Title

International Symposium on Electronic Materials and Packaging, EMAP 2000

Title Supplement

November 30 - December 2, 2000, Hong Kong

Person Involved

Corporate Author

Hong Kong University of Science and Technology, Department of Mechanical Engineering

Components, Packaging and Manufacturing Technology Society -CPMT-, Hong Kong Chapter

Electronic Packaging Laboratory -EPACK LAB-, Hong Kong

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2000

ISBN

0-7803-6654-9

Conference