Title

IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016

Title Supplement

December 14-16, 2016, Sheraton Waikiki, Honolulu, Hawaii

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2016

ISBN

978-1-5090-6185-3

978-1-5090-6184-6

978-1-5090-6186-0

Conference