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Title
Advanced packaging & the internet of things. The future of our industry. 48th International Symposium on Microelectronics, IMAPS 2015
Title Supplement
Orlando, Florida, USA, 26-29 October 2015
Person Involved
Corporate Author
International Microelectronics and Packaging Society -IMAPS-
Publisher
Publishing Place
Red Hook, NY
Publication Date
2016
ISBN
978-1-5108-1559-9