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Title
Interconnect challenges for CMOS technology. Materials, processes and reliability for downscaling, packaging and 3D stacking
Title Supplement
April 9 - 13, 2012, San Francisco, California, USA; Symposium C, held at 2012 MRS spring meeting
Person Involved
Corporate Author
Materials Research Society -MRS-
Publisher
Publishing Place
Cambridge
Publication Date
2012
Series
Materials Research Society Symposium Proceedings; 1428
ISBN
978-1-6274-8237-0