Title

Interconnect challenges for CMOS technology. Materials, processes and reliability for downscaling, packaging and 3D stacking
Titel Supplements
April 9 - 13, 2012, San Francisco, California, USA; Symposium C, held at 2012 MRS spring meeting
Institut
Materials Research Society -MRS-
Verlag
Verlagsort
Cambridge
Datum
2012
Serie
Materials Research Society Symposium Proceedings
ISBN
978-1-6274-8237-0
Konferenz