Title

Semiconductor Wafer Bonding 11. Science, Technology, and Applications

Title Supplement
In honor of Ulrich Gösele; Presented in the symposium entitled "Semiconductor Wafer Bonding 11: Science, Technology, and Applications - in Honor of Ulrich Gösele" held during the 218th meeting of the Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010
Person Involved
Corporate Author
Electrochemical Society -ECS-
Publisher
Publishing Place
Pennington, NJ
Publication Date
2010
Series
ECS transactions; 33.2010, Nr.4
ISSN
1938-5862
ISBN
978-1-566-77823-7
978-1-60768-173-1
Conference
DDC
660