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Title
21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, iTherm 2022
Title Supplement
31 May 2022 - 03 June 2022, San Diego, CA, USA
Publisher
Publication Date
2022
ISBN
978-1-6654-8503-6
978-1-6654-8502-9
978-1-6654-8504-3
Acronym
iTherm
Language
English