Title

IEEE 21st International Symposium for Design and Technology in Electronic Packaging, SIITME 2015

Title Supplement

Brasov, Romania, 22-25 October 2015

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2015

ISBN

978-1-5090-0333-4

978-1-5090-0331-0

978-1-5090-0332-7

Conference