Title

IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2013

Title Supplement

Nara, Japan, 12 - 15 December 201

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2013

ISBN

978-1-4799-2313-7

978-1-4799-3741-7

978-1-4799-2311-3

Conference