Title

Semiconductor Wafer Bonding: Science, Technology and Applications 16

Title Supplement

Held during PRiME 2020, Honolulu, Hawaii, from October 4-9, 2020, virtual event

Person Involved

Corporate Author

Electrochemical Society -ECS-

Electrochemical Society -ECS-, Electronics and Photonics Division

Publisher

Publishing Place

Pennington, NJ

Publication Date

2020

Series

ECS transactions; Vol.98, Nr.4

ISBN

978-1-71381-936-3

978-1-60768-899-0

Conference