Title

International Symposium on Advanced Packaging Materials 1999: Processes, Properties and Interfaces. Proceedings

Person Involved

Corporate Author

International Microelectronics and Packaging Society -IMAPS-

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Reston, Va.

Publication Date

1999

ISBN

0-930815-56-4

0-7803-5508-3

Conference