Title

IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017

Title Supplement

June 18-20, 2017, Göteborg, Sweden

Corporate Author

International Microelectronics and Packaging Society -IMAPS-, Nordic Chapter

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2017

ISBN

978-1-5386-3055-6

978-1-5386-3056-3

Conference