Title

TEI '18. Proceedings of the Twelfth International Conference on Tangible, Embedded, and Embodied Interaction

Title Supplement

March 18-21, 2018, Stockholm, Sweden

Corporate Author

Association for Computing Machinery -ACM-, Special Interest Group on Computer and Human Interaction -SIGCHI-

Publisher

Publishing Place

New York

Publication Date

2017

ISBN

978-1-4503-5568-1

Conference

Acronym

TEI