Title

9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014. Proceedings

Title Supplement
22-24 October 2014, Taipei; Challenges of Change - Shaping the Future; held in conjunction with the 16th EMAP, International Conference on Electronics Materials and Packaging
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
IEEE Components, Packaging, and Manufacturing Technology Society
International Microelectronics and Packaging Society -IMAPS-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2014
ISBN
978-1-4799-7727-7
Conference