9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014. Proceedings
Titel Supplements
22-24 October 2014, Taipei; Challenges of Change - Shaping the Future; held in conjunction with the 16th EMAP, International Conference on Electronics Materials and Packaging
Institut
Institute of Electrical and Electronics Engineers -IEEE-
IEEE Components, Packaging, and Manufacturing Technology Society
International Microelectronics and Packaging Society -IMAPS-
