Title

IMAPS/ACerS 2nd International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies CICMT 2006. Proceedings and exhibitor presentations. CD-ROM

Title Supplement

April 25 - 27, 2006, Denver, Colorado

Corporate Author

International Microelectronics and Packaging Society -IMAPS-

American Chemical Society -ACS-, Washington/D.C.

Publication Date

2006

Conference