Title

2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics 2001. Proceedings

Title Supplement

9 - 11 April 2001, Maison de la Chimie, Paris, France

Person Involved

Corporate Author

European Commission

IEEE Components, Packaging, and Manufacturing Technology Society

Publisher

Publishing Place

Paris

Publication Date

2001

ISBN

0-7803-9806-8

Conference