Title

Processing, Materials, and Integration of Damascene and 3D Interconnects

Title Supplement
Papers originally presented in the Symposium "Processing, Materials and Integration of Damascene and 3D Interconnects", held during the 216th meeting of the Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009
Person Involved
Corporate Author
Electrochemical Society -ECS-, Dielectric Science and Technology Division
Publisher
Publishing Place
Pennington, NJ
Publication Date
2010
Series
ECS transactions; Vol.25, Issue 38
ISBN
978-1-607-68162-5
978-1-56677-812-1
Conference