Title

11th International Congress Molded Interconnect Devices 2014. Scientific Proceedings

Title Supplement

Selected, Peer Reviewed Papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg

Person Involved

Publisher

Publishing Place

Zürich

Publication Date

2014

Series

Advanced materials research; 1038

ISBN

978-3-03835-252-5

978-3-03826-636-5

Conference