Title

20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019

Title Supplement

Hannover, Germany 24 - 27 March 2019

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2019

ISBN

978-1-5386-8041-4

978-1-5386-8040-7

978-1-5386-8039-1

Conference