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Title
20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Title Supplement
Hannover, Germany 24 - 27 March 2019
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2019
ISBN
978-1-5386-8041-4
978-1-5386-8040-7
978-1-5386-8039-1