Title

20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019
Titel Supplements
Hannover, Germany 24 - 27 March 2019
Institut
Institute of Electrical and Electronics Engineers -IEEE-
Verlag
Verlagsort
Piscataway, NJ
Datum
2019
ISBN
978-1-5386-8041-4
978-1-5386-8040-7
978-1-5386-8039-1
Konferenz