Title

58th Electronic Components and Technology Conference 2008. Proceedings. Vol.3
Titel Supplements
Lake Buena Vista, FL, 27 - 30 May 2008
Institut
IEEE Components, Packaging, and Manufacturing Technology Society
Electronic Components, Assemblies, and Materials Association
Verlag
Verlagsort
Piscataway, NJ
Datum
2008
ISBN
978-1-4244-2230-2
Konferenz