Title

13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012

Title Supplement

16 - 18 April 2012, Cascais, Portugal

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2012

ISBN

978-1-4673-1512-8

978-1-4673-1513-5

Conference