Options
Title
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012
Title Supplement
16 - 18 April 2012, Cascais, Portugal
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-
Publisher
Publishing Place
Piscataway, NJ
Publication Date
2012
ISBN
978-1-4673-1512-8
978-1-4673-1513-5