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Title
HD International Conference on High-Density Interconnect and Systems Packaging 2000. Proceedings
Title Supplement
25 - 28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA
Corporate Author
International Microelectronics and Packaging Society -IMAPS-
Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.
Publisher
Publishing Place
Reston, Va.
Publication Date
2000
Series
Proceedings of SPIE; 4217
ISBN
0-930815-60-2