Title

47th International Symposium on Microelectronics, IMAPS 2014. Future of Packaging

Title Supplement
San Diego, 13.-16.10.2014
Corporate Author
International Microelectronics and Packaging Society -IMAPS-
Publishing Place
San Diego/Calif.
Publication Date
2014
ISBN
978-0-9909-0280-5
978-0-9909028-0-5
978-1-63439-992-0
Conference