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Title
47th International Symposium on Microelectronics, IMAPS 2014. Future of Packaging
Title Supplement
San Diego, 13.-16.10.2014
Corporate Author
International Microelectronics and Packaging Society -IMAPS-
Publishing Place
San Diego/Calif.
Publication Date
2014
ISBN
978-0-9909-0280-5
978-0-9909028-0-5
978-1-63439-992-0