Title

IEEE International Conference on Metaverse Computing, Networking and Applications, MetaCom 2023. Proceedings

Title Supplement
Kyoto, Japan, 26-28 June 2023
Corporate Author
Institute of Electrical and Electronics Engineers -IEEE-  
Publisher
Publication Date
2023
ISBN
979-8-3503-3334-3
979-8-3503-3333-6
DOI
Conference
Acronym
MetaCom
Language
English