Title

21st International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2015

Title Supplement

Paris, France, 30 September - 2 October 2015

Corporate Author

Components, Packaging and Manufacturing Technology Society -CPMT-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2015

ISBN

978-1-4673-9705-6

978-1-4673-9706-3

Conference