Title

Semiconductor Wafer Bonding 13. Science, Technology, and Applications

Title Supplement
Held in Cancun, Mexico, as part of the 226th Meeting of the Electrochemical Society, in conjunction with the XXIX Congreso de la Sociedad Mexicana de Electroquimica, from October 5 to 9, 2014
Person Involved
Corporate Author
Electrochemical Society -ECS-
Publisher
Publishing Place
Pennington, NJ
Publication Date
2014
Series
ECS transactions; 64. 2014, Nr.5
ISBN
978-1-62332-185-7
978-1-60768-542-5
Conference