Title

6th Electronics Packaging Technology Conference, EPTC 2004. Proceedings

Title Supplement

8 - 10 December 2004, Pan Pacific Hotel, Singapore

Person Involved

Corporate Author

Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section

IEEE Components, Packaging, and Manufacturing Technology Society

International Microelectronics and Packaging Society -IMAPS-

Publisher

Publishing Place

Piscataway, NJ

Publication Date

2004

ISBN

0-7803-8821-6

0-7803-8822-4

Conference