• English
  • Deutsch
  • Log In
    Password Login
    or
  • Research Outputs
  • Projects
  • Researchers
  • Institutes
  • Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Hauptwerk
  4. Moisture sensitivity of plastic packages of IC devices
 
  • Information
  • Publications
Options
Title

Moisture sensitivity of plastic packages of IC devices

Institut
Micro- and opto-electronic materials, structures, and systems
Verlag
Springer
Verlagsort
Berlin
Datum
2010
ISBN
978-1-441-95718-4
978-1-441-95719-1
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Send Feedback
© 2022