English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Have you forgotten your password?
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Temperature Challenges for Integrated Systems due to High Power Density
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
2021
Presentation
Title
Temperature Challenges for Integrated Systems due to High Power Density
Title Supplement
Presentation held at ECPE Online Tutorial "Wide-Bandgap User Training", 20.05.2021
Show more
Author(s)
Schletz, Andreas
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Bayer, Christoph Friedrich
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Hutzler, Aaron
AHMT GmbH
Conference
Tutorial "Wide-Bandgap User Training" 2021
DOI
10.24406/publica-fhg-411242
File(s)
N-635218.pdf (3.9 MB)
Show more
Rights
Under Copyright
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
Keyword(s)
power semiconductors
DC-link capacitor
electrical insulation
die attach
high temperature
