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  4. TSV-based passive networks for monolithic integration in smartpower ICS for automotive applications
 
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2019
Presentation
Title

TSV-based passive networks for monolithic integration in smartpower ICS for automotive applications

Title Supplement
Presentation held at 10. GMM Fachtagung "Automotive meets Electronics 2019", 12./13.03.2019, Dortmund, Germany
Author(s)
Erlbacher, Tobias  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Rattmann, Gudrun  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
fachtagung "Automotive meets Electronics" (AmE) 2019  
File(s)
Download (1.53 MB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-404605
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
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