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2018
Presentation
Title

Power electronics packaging at Fraunhofer IISB

Title Supplement
Presentation held at SEMICON West 2018, July 10-12, 2018, San Francisco, California
Author(s)
Bayer, Christoph F.  
Conference
Conference and Expo "SEMICON West" 2018  
File(s)
Download (3 MB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-401071
Language
English
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Keyword(s)
  • power electronics packaging

  • double sided cooling

  • selectively sintering

  • ceramic embedding

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