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Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC
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1997
Conference Paper
Title
Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC
Author(s)
Auersperg, J.
Schubert, A.
Vogel, D.
Michel, B.
Reichl, H.
Mainwork
Application of fracture mechanics in electronic packaging
Conference
International Mechanical Engineering Congress and Exposition 1997
Symposium on Application of Fracture Mechanics in Electronic Packaging 1997
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
