Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC
| Chen, W.T. ; American Society of Mechanical Engineers -ASME-, Applied Mechanics Division:
Application of fracture mechanics in electronic packaging
New York, NY: ASME, 1997 (AMD 222)
ISBN: 0-7918-1827-6
pp.133-138 |
| International Mechanical Engineering Congress and Exposition <1997, Dallas/Tex.>
Symposium on Application of Fracture Mechanics in Electronic Packaging <1997, Dallas/Tex.> |
|
| English |
| Conference Paper |
| Fraunhofer IZM () |