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Application of fracture mechanics in electronic packaging
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Title
Application of fracture mechanics in electronic packaging
Institut
American Society of Mechanical Engineers -ASME-, Applied Mechanics Division
Verlag
ASME
Verlagsort
New York, NY
Datum
1997
Serie
AMD
EEP
Konferenz
International Mechanical Engineering Congress and Exposition 1997
Symposium on Application of Fracture Mechanics in Electronic Packaging 1997