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  4. g-Pack - a generic testbed package for silicon photonics devices
 
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2008
Conference Paper
Title

g-Pack - a generic testbed package for silicon photonics devices

Abstract
g-Pack is a low-frequency packaging approach to breadboarding of silicon photonics chips. It provides optical i/o through a fiber array coupled to gratings couplers, and multiple DC i/o through a pin grid array (PGA) carrier.
Author(s)
Zimmermann, L.
Schröder, H.
Tekin, T.
Bogaerts, W.
Dumon, P.
Mainwork
5th International Conference on Group IV Photonics 2008  
Conference
International Conference on Group IV Photonics 2008  
Open Access
DOI
10.1109/GROUP4.2008.4638203
Additional link
Full text
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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