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SIC device manufacturing using ion implantation. Opportunities and challenges

Presentation held at KTH IEEE Seminar, Stockholm, Sweden, 23.05.2019
 
: Erlbacher, Tobias

:
presentation urn:nbn:de:0011-n-5462322 (3.1 MByte PDF)
MD5 Fingerprint: 330bbcb7eb9397da5385baf1c2b8bb41
Created on: 30.5.2019


2019, 46 Folien
English
Presentation, Electronic Publication
Fraunhofer IISB ()
SIC-Microelectronic

: http://publica.fraunhofer.de/documents/N-546232.html