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Embroidering electrical interconnects with conductive yarn for the integration of flexible electronic modules into fabric

: Linz, Torsten; Kallmayer, C.

Fulltext urn:nbn:de:0011-n-350456 (1.2 MByte PDF)
MD5 Fingerprint: f33e149da60bb7f8779ad3ad49fbb6ad
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Created on: 19.12.2013

IEEE Computer Society:
Ninth IEEE International Symposium on Wearable Computers 2005. Proceedings : Osaka, Japan, October 18 - 21, 2005
Piscataway: IEEE Computer Society, 2005
ISBN: 0-7695-2419-2
International Symposium on Wearable Computers (ISWC) <9, 2005, Osaka>
Conference Paper, Electronic Publication
Fraunhofer IZM ()
wearable electronic; electronic in textile; integration; packaging; interconnection; embroidery; encapsulation; smart textile; intelligent textile; embroidered interconnection; conductive thread; washability; flexible substrate; microintegration; reliability; design rules

This paper shows how common embroidery can be used to integrate electronics into textile environment in a light and cost efficient way. A mechanism has been developed to embroider through flexible electronic modules using conductive yarn, thus creating an interconnection with other modules like sensors, batteries, textile keyboards, etc. Mold encapsulation has been found to improve the electrical contact and support the reliability of the whole system.