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Monolithic integration of MOEMS on CMOS backplanes using surface micromachining techniques

: List, Matthias; Friedrichs, Martin; Müller, Michael

Fulltext urn:nbn:de:0011-n-2228672 (760 KByte PDF)
MD5 Fingerprint: bc312ab397bc897948ac83fc3f8b9f5f
Created on: 12.12.2012

Hoffmann, Martin (Hrsg.) ; TU Ilmenau:
MME 2012, 23rd Micromechanics and Microsystems Europe Workshop. USB-Stick : September 9 - 12, Ilmenau, Germany; Proceedings
Ilmenau: Technische Universität Ilmenau, 2012
ISBN: 978-3-938843-71-0
Paper D20, 4 pp.
Micromechanics and Microsystems Europe Workshop (MME) <23, 2012, Ilmenau>
Conference Paper, Electronic Publication
Fraunhofer IPMS ()
MOEMS; sacrificial layer techniques; surface micromachining; monolithic integration; micro mirror array; spatial light modulator

A new generation of spatial light modulators (SLM) is being developed based on SiO2 sacrificial layer technology and multilevel actuator design. In this paper, we will present general requirements of monolithic integration of MOEMS structures on CMOS backplanes, advantages of used SiO2 sacrificial layer process and new structural MEMS material used to achieve long-term stable operation of high reflective mirrors.
This sophisticated micromachining technology will be demonstrated presenting actual spatial light modulator developments and key parameters of these devices.