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Novel packaging technology for body sensor networks based on adhesive bonding

A low cost, mass producible and high reliability solution
: Linz, Torsten; Krshiwoblozki, M. von; Walter, H.

Fulltext urn:nbn:de:0011-n-1729406 (1.3 MByte PDF)
MD5 Fingerprint: 88fe4997422510f0f6bd38e74978862c
Created on: 19.12.2013

Ling, K.-V. ; IEEE Computer Society:
International Conference on Body Sensor Networks, BSN 2010. Proceedings : 7-9 June 2010, Singapore
Piscataway, NJ: IEEE, 2010
ISBN: 978-0-7695-4065-8
International Conference on Body Sensor Networks (BSN) <7, 2010, Singapore>
Conference Paper, Electronic Publication
Fraunhofer IZM ()

This paper presents a new technology to connect electronic modules with textile circuits in a cost efficient and reliable way. Non-conductive thermoplastic polyurethane adhesive is applied to bond a test module onto the fabric with different types of conductive circuits. The adhesive is melted at a high temperature and mechanically fixed by subsequent cooling. The technology even allows contacting isolated conductors without having to remove the isolation in a separate step. Extensive temperature cycling, wash cycling and humidity tests have been carried out and it has been shown that the assembly is reliable under textile typical stress. At the end the paper demonstrates how sensors for body monitoring can benefit from this new technology.