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  4. 3D image sensor SiP with TSV silicon interposer
 
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2009
Conference Paper
Title

3D image sensor SiP with TSV silicon interposer

Abstract
3D system integration is a fast growing field that encompasses different types of technologies. [1] The technology chosen for a specific application will be selected according to the required electrical performance of the systems, the footprint, cost and time to market. Other important factors are the boundary conditions given for the specific components e.g. die size, integration compatibility, component availability (wafer vs. bare die) and testability. The paper discusses a specific 3D image sensor system for automotive applications. The system is based on wafer level technology using silicon interposer with Through Silicon Vias (TSV´s), a flip chip assembled sensor element and a microcontroller. The specific system concept, the technical solution and results are discussed.
Author(s)
Limansyah, I.
Infineon Technologies Munich
Wolf, J.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Klumpp, A.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Zoschke, K.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Wieland, R.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Klein, M.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Oppermann, H.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Nebrich, L.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Heinig, A.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Pechlaner, A.
Infineon Technologies Munich
Reichl, H.
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Weber, W.
Infineon Technologies Munich
Mainwork
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.3  
Conference
Electronic Components and Technology Conference (ECTC) 2009  
DOI
10.1109/ECTC.2009.5074199
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
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