Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Anordnung mit einem Substrat und zwei Bauelementen mit Lichtwellenleitern sowie Verfahren zur Herstellung
Oppermann, Hermann; Tekin, Tolga; Stockmeyer, Jörg; Fröhlich, Juliane
Patent
2021Design for Circularity Guidelines for the EEE Sector
Berwald, A.; Dimitrova, G.; Feenstra, T.; Onnekink, J.; Peters, H.; Vyncke, G.; Ragaert, K.
Zeitschriftenaufsatz
2021Dual-Rotor Electromagnetic-Based Energy Harvesting System for Smart Home Applications
Dinulovic, D.; Shousha, M.; Al-Batol, M.; Zafar, T.; Bickel, J.; Ngo, H.-D.; Haug, M.
Zeitschriftenaufsatz
2021Durability of smartphones: A technical analysis of reliability and repairability aspects
Cordella, M.; Alfieri, F.; Clemm, C.; Berwald, A.
Zeitschriftenaufsatz
2021Ecological Cost-Benefit Analysis of a Sensor-Based Parking Prediction Service
Druschke, J.; Fath, S.; Stobbe, L.; Nissen, N.F.; Richter, N.; Lang, K.-D.
Aufsatz in Buch
2021Fan-Out Wafer and Panel Level Packaging - A Platform for 3D Integration
Braun, T.; Becker, K.-F.; Töpper, M.; Aschenbrenner, R.; Schneider-Ramelow, M.
Konferenzbeitrag
2021Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2020/2021
 
Jahresbericht
2021Generative Machine Learning for Resource-Aware 5G and IoT Systems
Piatkowski, Nico; Mueller-Roemer, Johannes; Hasse, Peter; Bachorek, Adam; Werner, Tim; Birnstill, Pascal; Morgenstern, Andreas; Stobbe, Lutz
Konferenzbeitrag
2021High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications
Murugesan, K.S.; Chernobryvko, M.; Zinal, S.; Rossi, M.; Ndip, I.; Boettcher, M.; Lang, K.D.; Wieland, M.; Goetze, C.; Halim, S.B.; Trewhella, J.
Konferenzbeitrag
2021A high temperature SOI-CMOS chipset focusing sensor electronics for operating temperatures up to 300 °C
Kappert, Holger; Braun, Sebastian; Kordas, Norbert; Kosfeld, Andre; Utz, Alexander; Weber, Constanze; Rämer, Olaf; Spanier, Malte; Ihle, Martin; Ziesche, Steffen; Kokozinski, Rainer
Zeitschriftenaufsatz
2021Influence of Ball Size and Geometry on the Reliability and RF Performance of mmWave System-in-Package: A Simulation Approach
Dilek, S.; Ndip, I.; Rossi, M.; Tschoban, C.; Kuttler, S.; Wittler, O.; Lang, K.-D.; Goetze, C.; Berger, D.; Wieland, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2021Investigation of Deep Dry Etching of 4H SIC Material for MEMS Applications Using DOE Modelling
Erbacher, K.; Mackowiak, P.; Schiffer, M.; Lang, K.-D.; Schneider-Ramelow, M.; Ngo, H.-D.
Konferenzbeitrag
2021Methodology for Modeling the Energy and Material Footprint of Future Telecommunication Networks
Stobbe, L.; Nissen, N.F.; Druschke, J.; Zedel, H.; Richter, N.; Lang, K.-D.
Aufsatz in Buch
2021Monolithic integration of a smart temperature sensor on a modular silicon-based organ-on-a-chip device
Ponte, Ronaldo Martins da; Gaio, Nikolas; Zeijl, Henk van; Vollebregt, Sten; Dijkstra, Paul; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Zeitschriftenaufsatz
2021A Multi-Functional Reconfigurable Metasurface: Electromagnetic Design Accounting for Fabrication Aspects
Pitilakis, A.; Tsilipakos, O.; Liu, F.; Kossifos, K.M.; Tasolamprou, A.C.; Kwon, D.-H.; Mirmoosa, M.S.; Manessis, D.; Kantartzis, N.V.; Liaskos, C.; Antoniades, M.A.; Georgiou, J.; Soukoulis, C.M.; Kafesaki, M.; Tretyakov, S.A.
Zeitschriftenaufsatz
2021A New Filter Concept for High Pulse-Frequency 3-Phase AFE Motor Drives
Hoffmann, S.; Bock, M.; Hoene, E.
Zeitschriftenaufsatz
2021Optisches System, optische Komponente und Verfahren zum Herstellen eines optischen Systems
Oppermann, Hermann; Tekin, Tolga; Manier, Charles-Alix
Patent
2021Optisches System, Trägersubstrat und Verfahren zum Herstellen eines optischen Systems
Manier, Charles-Alix; Oppermann, Hermann; Zoschke, Kai; Tekin, Tolga
Patent
2021Quantifying the environmental impact of clustering strategies in waste management: A case study for plastic recycling from large household appliances
Bracquené, E.; Martinez, M.G.; Wagner, E.; Wagner, F.; Boudewijn, A.; Peeters, J.; Duflou, J.
Zeitschriftenaufsatz
2021Recyclability of tungsten, tantalum and neodymium from smartphones
Nissen, N.F.; Reinhold, J.; Schischke, K.; Lang, Klaus-Dieter
Aufsatz in Buch
2021RF Modeling and Measurement of a Novel Aperture-Coupled Hybrid Glass-Silicon 5G Antenna Array
Le, T.H.; Rossi, M.; Ndip, I.; Kaiser, M.; Manier, C.-A.; Gernhardt, R.; Oppermann, H.; Lang, K.-D.; Reichl, H.
Konferenzbeitrag
2021Rohstoffe für Zukunftstechnologien 2021
Marscheider-Weidemann, Frank; Langkau, Sabine; Eberling, Elisabeth; Erdmann, Lorenz; Haendel, Michael; Krail, Michael; Loibl, Antonia; Neef, Christoph; Neuwirth, Marius; Rostek, Leon; Shirinzadeh, Saeideh; Stijepic, Denis; Tercero Espinoza, Luis A.; Baur, Sarah-Jane; Billaud, Mathilde; Deubzer, Otmar; Maisel, Franziska; Marwede, Max; Rückschloss, Jana; Tippner, Max
Studie
2021Silicon photonics for terabit/s communication in data centers and exascale computers
Bernabé, S.; Wilmart, Q.; Hasharoni, K.; Hassan, K.; Thonnart, Y.; Tissier, P.; Désières, Y.; Olivier, S.; Tekin, T.; Szelag, B.
Review
2021Silicone encapsulation of thin-film SiOx, SiOxNy and SiC for modern electronic medical implants: A comparative long-term ageing study
Lamont, C.; Grego, T.; Nanbakhsh, K.; Shah Idil, A.; Giagka, V.; Vanhoestenberghe, A.; Cogan, S.; Donaldson, N.
Zeitschriftenaufsatz
2021Smart sensor systems for extremely harsh environments
Kappert, Holger; Schopferer, Sebastian; Döring, Ralf; Ziesche, Steffen; Olowinsky, Alexander; Naumann, Falk; Jaegle, Martin; Ostmann, Andreas
Konferenzbeitrag
2021Study on FO-WLP Warpage Behavior - Influence of Process Temperature and Geometry
Dijk, M. van; Huber, S.; Stegmaier, A.; Walter, H.; Wittler, O.; Schneider-Ramelow, M.
Konferenzbeitrag
2021Thermo-mechanical-optical coupling within a digital twin development for automotive LiDAR
Tavakolibasti, M.; Meszmer, P.; Böttger, G.; Kettelgerdes, M.; Elger, G.; Erdogan, H.; Seshaditya, A.; Wunderle, B.
Konferenzbeitrag
2021Verbindungsmethode für Leistungsmodule mit einer Zwischenkreisverschienung
Hoene, Eckart
Patent
2021Washability of e-textiles: Current testing practices and the need for standardization
Rotzler, S.; Krshiwoblozki, M. von; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020(How) can service design and digitalization be used to transition to the circular economy?
Scholz, Ronja; Malila, Saija; Vihma, Markus; Marwede, Max; Cygert, Karolina
Konferenzbeitrag
2020Assessment of the influencing parameters of the tumble test for robustness testing of smartphones
Dobs, Tom; Sánchez, David; Schischke, Karsten; Wittler, Olaf; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Bestandsaufnahme Smartphones. Übersicht Modellhistorie und modulare Konzepte
Proske, Marina; Baur, Sarah-Jane; Rückschloss, Jana; Teusch,Christoph; Krause, Thomas; Poppe, Erik
Bericht
2020Bidirectional Bioelectronic Interfaces: System Design and Circuit Implications
Liu, Yan; Urso, Alessandro; Martins da Ponte, Ronaldo; Costa, Tiago; Valente, Virgilio; Giagka, Vasiliki; Serdijn, Wouter A.; Constandinou, Timothy G.; Denison, Timothy
Zeitschriftenaufsatz
2020Bondfolie, elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
Hempel, Martin; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2020Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
Zoschke, K.; MacKowiak, P.; Kröhnert, K.; Oppermann, H.; Jürgensen, N.; Wietstruck, M.; Göritz, A.; Tolunay Wipf, S.; Kaynak, M.; Lang, K.-D.
Konferenzbeitrag
2020Chiplets - Exploring the Green Potential of Advanced Multi-Chip Packages
Nissen, Nils F.; Clemm, Christian; Billaud, Mathilde; Töpper, Michael; Stobbe, Lutz; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Circuit Design Considerations for Power-Efficient and Safe Implantable Electrical Neurostimulators
Guan, Rui; Zufiria, Pedro G.; Giagka, Vasiliki; Serdijn, Wouter A.
Konferenzbeitrag
2020Circular literacy. A knowledge-based approach to the circular economy
Zwiers, J.; Jaeger-Erben, M.; Hofmann, F.
Zeitschriftenaufsatz
2020Condition monitoring of power electronic modules for predictive maintenance
Wagner, Stefan; Wüst, Felix; Sehr, Frederic; Dobs, Tom; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Current State of Durability Assessment for Four Consumer Product Groups
Hahn, Daniel; Sehr, Frederic; Straube, Stefan; Dobs, Tom; Berwald, Anton; Wittler, Olaf; Schneider-Ramelos, Martin
Konferenzbeitrag
2020Customer acceptance of mobile devices with permanently installed batteries and accumulators
Winzer, Janis; Czichowski, Johanna; Lascho, Tobias; Bill, Stine; Hipp, Tamina; Wagner, Eduard; Jaeger-Erben, Melanie
Konferenzbeitrag
2020Decomposing software obsolescence cases - a cause and effect analysis framework for software induced product replacement
Wagner, Eduard; Poppe, Erik; Hahn, Florian; Jaeger-Erben, Melanie; Druschke, Jan; Nissen, Nils F.; Lang, Klaus-Dieter
Konferenzbeitrag
2020Das Design bestimmt die Ökobilanz. Mobile Endgeräte im Umweltfokus
Schischke, Karsten
Zeitschriftenaufsatz
2020Design for and Design from Recycling: The Key Pillars of Circular Product Design
Dimitrova, G.; Berwald, A.; Feenstra T.; Höggerl, G.; Nissen, N.F.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Development and characterization of a novel low-cost water-level and water quality monitoring sensor by using enhanced screen printing technology with PEDOT:PSS
Wang, B.; Baeuscher, M.; Hu, X.; Woehrmann, M.; Becker, K.; Juergensen, N.; Hubl, M.; Mackowiak, P.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Zeitschriftenaufsatz
2020Double pulse vs. indirect measurement: Characterizing switching losses of integrated power modules with wide bandgap semiconductors
Kuczmik, A.; Hoffmann, S.; Hoene, E.
Konferenzbeitrag
2020Dreidimensionale Antennenvorrichtung
Ndip, Ivan; Kallmayer, Christine; Lang, Klaus-Dieter
Patent
2020Dreidimensionale Schleifen-Antennenvorrichtung
Ndip, Ivan; Kallmayer, Christine; Lang, Klaus-Dieter
Patent
2020An end-to-end 5G automotive ecosystem for autonomous driving vehicles
Raddo, T.R.; Cimoli, B.; Sirbu, B.; Rommel, S.; Tekin, T.; Tafur Monroy, I.
Konferenzbeitrag
2020An end-to-end 5G fiber wireless A-RoF/IFoF link based on a 60 GHz beamsteering antenna and an InP EML
Vagionas, C.; Ruggeri, E.; Kalfas, G.; Sirbu, B.; Leiba, Y.; Kanta, K.; Giannoulis, G.; Caillaud, C.; Cerulo, G.; Mallecot, F.; Raddo, T.R.; Mesodiakaki, A.; Gatzianas, M.; Apostolopoulos, D.; Avramopoulos, H.; Tafur-Monroy, I.; Tekin, T.; Miliou, A.; Pleros, N.
Konferenzbeitrag
2020Engineer the Channel and Adapt to it: Enabling Wireless Intra-Chip Communication
Timoneda, X.; Abadal, S.; Franques, A.; Manessis, D.; Zhou, J.; Torrellas, J.; Alarcón, E.; Cabellos-Aparicio, A.
Zeitschriftenaufsatz
2020Environmental Impacts of Modular Design - Life Cycle Assessment of the Fairphone 3
Proske, Marina; Clemm, Christian; Sánchez Fernández, David; Ballester Salvà, Miquel; Jügel, Marvin; Kukuk-Schmid, Heike; Nissen, Nils F.; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Extended Product Lifespan Abroad - Assessing Repair Sector in Ghana
Groscurth, Balthasar; Batteiger, Alexander; Deubzer, Otmar; Jaeger-Erben, Melanie
Konferenzbeitrag
2020Fan-out wafer level packaging of GaN components for RF applications
Braun, Tanja; Nguyen, Thanh Duy; Voges, Steves; Wöhrmann, Markus; Gernhardt, Robert; Becker, Karl-Friedrich; Ndip, Ivan; Freimund, Damian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schwantuschke, Dirk; Ture, Erdin; Pretl, Michael; Engels, Sven
Konferenzbeitrag
2020FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
Grams, A.; Jaeschke, J.; Wittler, O.; Fabian, B.; Thomas, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Thomas, T.; Dijk, M. van; Dreissigacker, M.; Hoffmann, S.; Walter, H.; Becker, K.-F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Flexible, stretchable, conformal electronics, and smart textiles: Environmental life cycle considerations for emerging applications
Schischke, K.; Nissen, N.F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2019/2020
 
Jahresbericht
2020Grading system for post-consumer recycled plastics from WEEE
Wagner, Florian; Bracquene, Ellen; Wagner, Eduard; Keyzer, Jozefien de; Duflout, Joost R.; Dewulf, Wim; Peeters, Jef R.
Konferenzbeitrag
2020How long do we care? The role of consumer practices for sustainable electronics
Jaeger-Erben, Melanie; Hipp, Tamina; Frick, Vivian
Konferenzbeitrag
2020Improving the washability of smart textiles: influence of different washing conditions on textile integrated conductor tracks
Rotzler, S.; Kallmayer, C.; Dils, C.; Krshiwoblozki, M. von; Bauer, U.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Influence of temperature and humidity on power cycling capability of power modules
Wuest, F.; Wittler, O.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Integrated optical single-mode waveguide structures in thin glass for flip-chip PIC assembly and fiber coupling
Schwietering, J.; Herbst, C.; Kirsch, O.; Arndt-Staufenbiel, N.; Wachholz, P.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2020International Congress "Electronics Goes Green 2020+". Proceedings
: Schneider-Ramelow, Martin
Tagungsband
2020Life Cycle Assessment of the Fairphone 3
Proske, Marina; Sánchez, David; Clemm, Christian; Baur, Sarah-Jane
Studie
2020Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implants
Nanbakhsh, Kambiz; Ritasalo, Riina; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Low inductive full ceramic sic power module for high-temperature automotive applications
Klein, K.; Rämer, O.; Hoene, E.; Yasuda, Y.; Ito, H.; Kurita, F.; Enoki, M.; Nakamura, H.; Okishiro, K.
Konferenzbeitrag
2020Low voltage silicon photonic modulators and switches for high radix integrated transmitters
Brimont, A.; Zanzi, A.; Vagionas, C.; Pegios, M.M.; Vyrsokinos, K.; Pleros, N.; Kraft, J.; Sidorov, V.; Sirbu, B.; Tekin, T.; Sanchis, P.
Konferenzbeitrag
2020Low-Loss Multimode Glass Waveguides With Beam-Expanded Fiber Connectors Enabling On-Board Optical Links
Brusberg, L.; Zakharian, A.R.; Neitz, M.; Li, S.; Hathaway, B.A.; Kuchinsky, S.A.; Beneke, P.; Schröder, H.
Zeitschriftenaufsatz
2020Market Trends in Smartphone Design and Reliability Testing
Clemm, Christian; Berwald, Anton; Prewitz, Carolin; Nissen, Nils F.; Schneider-Ramelow, Martin
Konferenzbeitrag
2020Memory-assisted Statistically-ranked RF Beam Training Algorithms for Sparse MIMO
Tiwari, K.K.; Grass, E.; Thompson, J.S.
Konferenzbeitrag
2020Morphologies of primary Cu6Sn5 and Ag3Sn intermetallics in Sn-Ag-Cu solder balls
Mueller, M.; Panchenko, I.; Wiese, S.; Wolter, K.-J.
Zeitschriftenaufsatz
2020A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems
Ndip, I.; Andersson, K.; Kosmider, S.; Le, T.H.; Kanitkar, A.; Dijk, M. van; Senthil Murugesan, K.; Maaß, U.; Löher, T.; Rossi, M.; Jaeschke, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2020Novel technology for dispensing liquid polymers of a wide viscosity range on a picoliter scale for photonic applications
Wachholz, P.; Wolf, J.; Marx, S.; Weber, D.; Klein, J.; Schröder, H.
Konferenzbeitrag
2020Obsolescence in LCA - methodological challenges and solution approaches
Proske, Marina; Finkbeiner, Matthias
Zeitschriftenaufsatz
2020On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Organizational transition management of circular business model innovations
Hofmann, F.; Jaeger-Erben, M.
Zeitschriftenaufsatz
2020Overview of Circular Economy Practices in High-tech Manufacturing Industries
Schischke, Karsten; Billaud, Mathilde; Reinhold, Julia; Nissen, Nils F.; Schneider-Ramelow, Martin
Konferenzbeitrag
2020PDMS-Parylene Adhesion Improvement via Ceramic Interlayers to Strengthen the Encapsulation of Active Neural Implants
Bakhshaee, Nasim; Dekker, Ronald; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics
Maisel, F.; Chancerel, P.; Dimitrova, G.; Emmerich, J.; Nissen, N.F.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020Process modules for high-density interconnects in panel-level packaging
Schein, Friedrich-Leonhard; Kahle, Ruben; Kunz, Marc; Kunz, Tim; Kossev, Jordan; Müller, Tobias; Pentz, Mathias; Dietterle, Michael; Ostmann, Andreas
Zeitschriftenaufsatz
2020Product clustering as a strategy for enhanced plastics recycling from WEEE
Duflou, J.R.; Boudewijn, A.; Cattrysse, D.; Wagner, F.; Accili, A.; Dimitrova, G.; Peeters, J.R.
Zeitschriftenaufsatz
2020Real-time impedance monitoring of epithelial cultures with inkjet-printed interdigitated-electrode sensors
Mojena-Medina, D.; Hubl, M.; Bäuscher, M.; Jorcano, J.L.; Ngo, H.-D.; Acedo, P.
Zeitschriftenaufsatz
2020Reliability Investigation of Ultra Fine Line, Multi-Layer Copper Routing for Fan-Out Packaging Using a Newly Designed Micro Tensile Test Method
Woehrmann, M.; Keller, A.; Fritzsch, T.; Schiffer, M.; Gollhardt, A.; Walter, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2020Review of the List of Restricted Substance (Annex II) of Directive 2011/65/EU (RoHS)
Baron, Yifaat; Moch Katja; Clemm, Christian; Gensch, Carl-Otto; Koehler, Andreas; Deubzer, Otmar; Loew, Clara
Konferenzbeitrag
2020Robust converters for renewable energy plants
Bayer, Christoph Friedrich; Wagner, Stefan
Zeitschriftenaufsatz
2020Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2020Sensor platform based on packaged whispering-gallery-resonators
Zamora, V.; Herter, J.; Wunderlich, V.; Nguyen, T.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Simulation challenges of warpage for wafer- and panel level packaging
Dijk, M. van; Kuttler, S.; Rost, F.; Jeaschke, J.; Walter, H.; Wittler, O.; Braun, T.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Simultaneous X‐Ray Diffraction and Tomography Operando Investigation of Aluminum/Graphite Batteries
Elia, G.A.; Greco, G.; Kamm, P.H.; Garcia-Moreno, F.; Raoux, S.; Hahn, R.
Zeitschriftenaufsatz
2020The smartphone evolution - an analysis of the design evolution and environmental impact of smartphones
Proske, Marina; Poppe, Erik; Jaeger-Erben, Melanie
Konferenzbeitrag
2020A time-temperature-moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging
Huber, F.; Etschmaier, H.; Walter, H.; Urstöger, G.; Hadley, P.
Zeitschriftenaufsatz
2020Toroidal multilayer mirrors for laboratory soft X-ray grazing emission X-ray fluorescence
Baumann, J.; Jonas, A.; Reusch, R.; Szwedowski-Rammert, V.; Spanier, M.; Grötzsch, D.; Bethke, K.; Pollakowski-Herrmann, B.; Krämer, M.; Holz, T.; Dietsch, R.; Mantouvalou, I.; Kanngießer, B.
Zeitschriftenaufsatz
2020Toward the Realization of a Programmable Metasurface Absorber Enabled by Custom Integrated Circuit Technology
Kossifos, K.M.; Petrou, L.; Varnava, G.; Pitilakis, A.; Tsilipakos, O.; Liu, F.; Karousios, P.; Tasolamprou, A.C.; Seckel, M.; Manessis, D.; Kantartzis, N.V.; Kwon, D.-H.; Antoniades, M.A.; Georgiou, J.
Zeitschriftenaufsatz
2020Towards CMOS Bulk Sensing for In-Situ Evaluation of ALD Coatings for Millimeter Sized Implants
Nanbakhsh, Kambiz; Ritasalo, Riina; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2020Using Post-Consumer Recycled Plastics in new EEE. A promising Circular Business Model for the Electronics Sector
Maisel, F.; Emmerich, J.; Dimitrova, G.; Berwald, A.; Nissen, N.F.; Schneider-Ramelow, M.
Konferenzbeitrag
2020Uv sensor based on fiber bragg grating covered with graphene oxide embedded in composite materials
Lesiak, P.; Bednarska, K.; Małkowski, K.; Kozłowski, L.; Wróblewska, A.; Sobotka, P.; Dydek, K.; Boczkowska, A.; Osuch, T.; Anuszkiewicz, A.; Lewoczko-Adamczyk, W.; Schröder, H.; Woliński, T.R.
Zeitschriftenaufsatz
2020Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
Huber, F.; Etschmaier, H.; Dobs, T.; Walter, H.; Wittler, O.; Hadley, P.
Zeitschriftenaufsatz
2020Vorrichtung zum Erfassen eines Drucks eines Fluids
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong
Patent
2020Wafer-Scale Graphene-Based Soft Electrode Array with Optogenetic Compatibility
Velea, Andrada Iulia; Vollebregt, Sten; Wardhand, Gandhika K.; Giagka, Vasiliki
Konferenzbeitrag
2020Wechselspannungsversorgungseinrichtung
Hoene, Eckart
Patent
20193D modular power electronic systems, based on embedded components
Boettcher, L.; Karaszkiewicz, S.; Löher, Th.; Manessis, D.; Ostmann, A.
Zeitschriftenaufsatz
20193D system integration on 300 mm wafer level
Kilige, S.; Bartusseck, I.; Junige, M.; Neumann, V.; Reif, J.; Wenzel, C.; Böttcher, M.; Albert, M.; Wolf, M.J.; Bartha, J.W.
Zeitschriftenaufsatz
2019Advanced through silicon vias for hybrid pixel detector modules
Hügging, F.; Owtscharenko, N.; Pohl, D.-L.; Wermes, N.; Ehrmann, O.; Fritzsch, T.; Mackowiak, P.; Oppermann, H.; Rothermund, M.; Zoschke, K.
Zeitschriftenaufsatz
2019Alignment tolerant, low voltage, 0.23 V.cm, push-pull silicon photonic switches based on a vertical pn junction
Zanzi, A.; Vagionas, C.; Griol, A.; Rosa, A.; Lechago, S.; Moralis-Pegios, M.; Vyrsokinos, K.; Pleros, N.; Kraft, J.; Sidorov, V.; Sirbu, B.; Tekin, T.; Sanchis, P.; Brimont, A.
Zeitschriftenaufsatz
2019An approach for failure prediction in H3 TRB-tests
Kolbinger, E.; Wuest, F.; Dijk, M. van; Trampert, S.; Lang, K.-D.
Konferenzbeitrag
2019Autarke Mikrosysteme: Anwendungen in der Energiewirtschaft
Laß, D.; Brockmann, C.; Stube, B.; Lang, K.-D.
Konferenzbeitrag
2019A Chip Integrity Monitor for Evaluating Long-term Encapsulation Performance within Active Flexible Implants
Akgun, Omer Can; Nanbakhsh, Kambiz; Giagka, Vasiliki; Serdijn, Wouter A.
Konferenzbeitrag
2019Circular business models: Business approach as driver or obstructer of sustainability transitions?
Hofmann, F.
Zeitschriftenaufsatz
2019Closed-form multipole debye model for time-domain modeling of lossy dielectrics
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Zeitschriftenaufsatz
2019Closed-loop hydrometallurgical treatment of end-of-life lithium ion batteries: Towards zero-waste process and metal recycling in advanced batteries
Atia, T.A.; Elia, G.; Hahn, R.; Altimari, P.; Pagnanelli, F.
Zeitschriftenaufsatz
2019Comments on "Compact, Energy-Efficient High-Frequency Switched Capacitor Neural Stimulator with Active Charge Balancing" (vol 11, pg 878-888, 2017)
Urso, A.; Giagka, V.; Serdijn, W.A.
Zeitschriftenaufsatz
2019Compact wideband wilkinson power divider in thin-film glass technology for 5G applications
Murugesan, K.S.; Voigt, T.; Tschoban, C.; Rossi, M.; Ndip, I.; Lang, K.-D.; Nädele, D.; Student, R.; Dengler, D.
Konferenzbeitrag
2019Condition monitoring for failure monitoring of power electronic assemblies
Wagner, Stefan; Wuest, Felix; Trampert, Stefan; Sehr, Frederic; Middendorf, Andreas; Wittler, Olaf; Schneider-Ramelow, Martin
Konferenzbeitrag
2019Conformable Electronics: Integration of electronic functions into static and dynamic free form surfaces
Löher, T.; Seckel, M.; Haberland, J.; Marques, J.; Krshiwoblozki, M. von; Kallmayer, C.; Ostmann, A.
Konferenzbeitrag
2019Crosstalk Effects of Differential Thin-Film Microstrip Lines in Multilayer Motherboards
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Fritzsch, T.; Schulz, S.; Heinrich, W.
Konferenzbeitrag
2019Decreasing obsolescence with modular smartphones? - An interdisciplinary perspective on lifecycles
Proske, Marina; Jaeger-Erben, Melanie
Zeitschriftenaufsatz
2019Design of a Low-Capacitance Planar Transformer for a 4 kW/500 kHz DAB Converter
Demumieux, P.; Avino-Salvado, O.; Buttay, C.; Martin, C.; Sixdenier, F.; Joubert, C.; Magambo, J.S.N.T.; Loher, T.
Konferenzbeitrag
2019Development of a glass technology based 79 GHz MIMO radar front-end module for autonomous driving
Tschoban, C.; Rossi, M.; Reyes, J.; Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2019Editorial for the Special Issue on MEMS Accelerometers
Rasras, M.; Elfadel, I.M.; Ngo, H.D.
Editorial
2019Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants
Nanbakhsh, Kambiz; Kluba, Marta; Pahl, Barbara; Bourgeois, Florian; Dekker, Ronald; Serdijn, Wouter; Giagka, Vasiliki
Konferenzbeitrag
2019Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking
Panchenko, I.; Wolter, K.-J.; Croes, K.; Wolf, I. de; Messemaeker, J. de; Beyne, E.; Wolf, M.J.
Zeitschriftenaufsatz
2019Embedding as a key board-level technology for modularization and circular design of smart mobile products: Environmental assessment
Schischke, K.; Manessis, D.; Pawlikowski, J.; Kupka, T.; Krivec, T.; Pamminger, R.; Glaser, S.; Podhradsky, G.; Nissen, N.F.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2019Embedding technologies for the manufacturing of advanced miniaturised modules toward the realisation of compact and environmentally friendly electronic devices
Manessis, D.; Schischke, K.; Pawlikowski, J.; Krivec, T.; Schulz, G.; Podhradsky, G.; Aschenbrenner, R.; Schneider-Ramelow, M.; Ostmann, A.; Lang, K.-D.
Konferenzbeitrag
2019Entwicklung eines MIMO-Radarfrontends auf Glasinterposer Basis fürs autonome Fahren
Tschoban, C.; Fritsche, C.; Böttcher, M.; Steller, W.; Ndip, I.; Pötter, H.
Konferenzbeitrag
2019Entwicklung eines neuartigen, quantitativen Adhäsionsmessverfahren für Dünnfilmlagen in der Mikroelektronik
Wöhrmann, Markus; Toepper, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019ErP - the european directive on ecodesign
Nissen, N.F.
Aufsatz in Buch
2019Evaluation of adaptive processes for the embedding of bare dies in IC substrates
Kahle, R.; Schein, F.-L.; Ostmann, A.
Konferenzbeitrag
2019Exploration of Intercell Wireless Millimeter-Wave Communication in the Landscape of Intelligent Metasurfaces
Tasolamprou, A.C.; Pitilakis, A.; Abadal, S.; Tsilipakos, O.; Timoneda, X.; Taghvaee, H.; Mirmoosa, M.S.; Liu, F.; Liaskos, C.; Tsioliaridou, A.; Ioannidis, S.; Kantartzis, N.V.; Manessis, D.; Georgiou, J.; Cabellos-Aparicio, A.; Alarcon, E.; Pitsillides, A.; Akyildiz, I.F.; Tretyakov, S.A.; Economou, E.N.; Kafesaki, M.; Soukoulis, C.M.
Zeitschriftenaufsatz
2019Fabrication of high voltage capable TSV using backside via last process and laser abblation of dry film BCB
MacKowiak, P.; Wilke, M.; Wöhrmann, M.; Gernhard, R.; Zoschke, K.; Lang, K.-D.; Scheider-Ramelow, M.; Ngo, H.-D.
Konferenzbeitrag
2019Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Braun, T.; Becker, K.F.; Hoelck, O.; Voges, S.; Kahle, R.; Dreissigacker, M.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2019Fiber-coupled photonic interconnects based on stacked glass block connectors
Zamora, V.; Schröder, H.; Marx, S.; Herter, J.; Brauda, D.; Lewoczko-Adamczyk, W.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018/2019
 
Jahresbericht
2019Glas-Chips zur Messung der Wärmeleitfähigkeit
Grosse, C.; Ras, M.A.; May, D.; Wöhrmann, M.; Bader, V.; Bauer, J.; Wunderle, B.
Konferenzbeitrag
2019HBM and ASIC silicon interposer
Puschmann, René; Heinig, Andy
Konferenzbeitrag
2019Hermetically Sealed Glass Package for Highly Integrated MMICs
Galler, T.; Chaloun, T.; Kröhnert, K.; Schulz-Ruhtenberg, M.; Waldschmidt, C.
Konferenzbeitrag
2019Hermetisch abgedichtete Moduleinheit mit integrierten Antennen
Löher, Thomas; Ndip, Ivan; Lang, Klaus-Dieter
Patent
2019Herstellung extrem kleiner Batterien mit Dünnwafer-Bondprozessen
Hahn, R.; Hoeppner, K.; Ferch, M.; Zoschke, K.; Lang, K.-D.
Konferenzbeitrag
2019High density fan-out panel level packaging of multiple dies embedded in IC substrates
Schein, F.-L.; Kahle, R.; Kunz, M.; Ostmann, A.
Konferenzbeitrag
2019High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche,Carola; Ndip, Ivan; Kröhnert, Kevin; Lang, Klaus-Dieter
Konferenzbeitrag
2019High frequency substrate technologies for the realisation of software programmable metasurfaces on PCB hardware platforms with integrated controller nodes
Manessis, D.; Seckel, M.; Fu, L.; Tsilipakos, O.; Pitilakis, A.; Tasolamprou, A.; Kossifos, K.; Varnava, G.; Liaskos, C.; Kafesaki, M.; Soukoulis, C.M.; Tretyakov, S.; Georgiou, J.; Ostmann, A.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2019High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
Zoschke, Kai; Mackowiak, Piotr; Ngo, Ha-Duong; Tschoban, Christian; Fritsche, Carola; Kröhnert, Kevin; Fischer, Thorsten; Ndip, Ivan; Lang, K.-D.
Konferenzbeitrag
2019High-throughput battery materials testing based on test cell arrays and dispense/jet printed electrodes
Hahn, R.; Ferch, M.; Tribowski, K.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Lang, K.D.; Bock, W.
Zeitschriftenaufsatz
2019Increasing the productivity of the novel atmospheric pressure sputtering technology for 3D chip interconnection
Bickel, Jan; Ngo, Ha-Duong; Schneider Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Influence of microwave probes on calibrated on-wafer measurements
Phung, G.N.; Schmückle, F.J.; Doerner, R.; Kähne, B.; Fritzsch, T.; Arz, U.; Heinrich, W.
Zeitschriftenaufsatz
2019Innovative Sub-5-μ m Microvias by Picosecond UV Laser for Post-Moore Packaging Interconnects
Liu, F.; Khurana, G.; Zhang, R.; Watanabe, A.; DeProspo, B.H.; Nair, C.; Tummala, R.R.; Swaminathan, M.
Zeitschriftenaufsatz
2019Integrated condition monitoring by measuring the delay of gate turn-off
Wuest, F.; Trampert, S.; Sehr, F.; Lang, K.-D.
Konferenzbeitrag
2019Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method
Bäuscher, M.; Reinicke, O.; Henke, M.; MacKowiak, P.; Schiffer, M.; Schneider-Ramelow, M.; Lang, K.-D.; Ngo, H.-D.
Konferenzbeitrag
2019Investigation of the mechanical and electrical properties of elastic textile/polymer composites for stretchable electronics at quasi-static or cyclic mechanical loads
Dils, C.; Werft, L.; Walter, H.; Zwanzig, M.; Krshiwoblozki, M. von; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2019Latest advancements towards delamination detection in a FCOB assembly using Thermal Pixel (Thixel) array
Kumar, A.; Schulz, M.; Bader, V.; Wöhrmann, M.; Bauer, J.; May, D.; Puri, A.; Abo Ras, M.; Wunderle, B.
Konferenzbeitrag
2019Layer analysis of partial atmospheric pressure sputtering for high temperature packaging applications
Bickel, Jan; Eberl, Maria; Kaletta, Katrin; Ngo, Ha-Duong; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mems Mass Flow Controller for Liquid Fuel Supply to HCCI-Driven Engine
Schiffer, Michael; Mackowiak, Piotr; Ngo, Ha-Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019Metallic Interconnection Technologies for High Power Vertical Cavity Surface Emitting Lasers Modules
Weber, Constanze; Goullon, Lena; Hutter, Matthias; Schneider-Ramelow, Martin
Aufsatz in Buch
2019Miniaturized 24 GHz Radar Positioning Transponder Module
Fritzsch, Thomas; Tschoban, Christian; Böttcher, Mathias; Windrich, Frank; Phung, Gia Ngoc; Lang, Klaus-Dieter
Konferenzbeitrag
2019Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2019Moduleinheit mit integrierten Antennen
Ndip, Ivan; Zoschke, Kai; Lang, Klaus-Dieter
Patent
2019Nicht-invasives Rehabilitationssystem für irreparable Nervenschädigungen im Handgelenksbereich
Bücheler, L.; Hillmer, I.; Reimer, V.; Jiang, Y.; Angelmahr, M.; Schade, W.; Krshiwoblozki, M. von; Pawlikowski, J.; Garbacz, K.; Stagun, L.; Fischer, M.; Guttowski, S.
Konferenzbeitrag
2019Numerical estimation of local load during manufacturing process in high temperature PCB resin based on viscoelastic material modeling
Schmidt, M.; Maniar, Y.; Ratchev, R.; Kabakchiev, A.; Guyenot, M.; Walter, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Numerical Investigation of Anodic Bonding for Stress Sensitive MEMS Device
Hu, Xiaodong; Schiffer, Michael; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
2019A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Zeitschriftenaufsatz
2019Numerische und experimentelle Betrachtung des Molded Underfills
Paetsch, M.; Nguyen, T.D.; Dreissigacker, M.; Bauer, J.; Hoelck, O.; Bader, V.; Braun, T.; Zuehlke, J.; Minkus, M.; Voges, S.; Becker, K.-F.; Woehrmann, M.; Lang, K.-D.; Schubert, D.W.; Schneider-Ramelow, M.
Konferenzbeitrag
2019An Overview about the Excimer Laser Ablation of Different Polymers and their Application for Wafer and Panel Level Packaging
Gernhardt, R.; Wöhrmann, M.; Müller, F.; Hauck, K.; Töpper, M.; Lang, K.-D.; Hichri, H.; Arendt, M.
Konferenzbeitrag
2019Panel Level Packaging - From Idea to Industrialization -
Braun, T.; Becker, K.-F.; Hoelck, O.; Voges, S.; Boettcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Voitel, M.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2019Panel Level Packaging for Component Integration of an Energy Harvesting System
Braun, T.; Kahle, R.; Voges, S.; Hölck, O.; Bauer, J.; Becker, K.-F.; Aschenbrenner, R.; Dreissigacker, M.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2019Piezo-plunger jetting technology: An experimental study on jetting characteristics of filled epoxy polymers
Kurz, A.; Bauer, J.; Wagner, M.
Zeitschriftenaufsatz
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2019Pressure measurement of geometrically curved ultrasound transducer array for spatially specific stimulation of the vagus nerve
Kawasaki, S.; Giagka, V.; Haas, M. de; Louwerse, M.; Henneken, V.; Heesch, C. van; Dekker, R.
Konferenzbeitrag
2019Process flow and cost modelling for fan-out panel level packaging
Billaud, M.; Zedel, H.; Stobbe, L.; Braun, T.; Nissen, N.; Lang, K.-D.
Konferenzbeitrag
2019Process optimization and implementation of online monitoring process in the transfer molding for electronic packaging
Kaya, B.; Kaiser, J.-M.; Becker, K.-F.; Braun, T.; Lang, K.-D.
Zeitschriftenaufsatz
2019Realisierung und Anwendung energieautarker miniaturisierter Funksensorik: Chancen durch IoT, 5G und Narrowband
Brockmann, Carsten; Günther-Sorge, Julia; Pötter, Harald
Zeitschriftenaufsatz
2019Die Realisierung von Umverdrahtungslagen mittels Inkjet-Printing im Fan-Out Wafer Level Packaging
Dreissigacker, M.; Roshanghias, A.; Becker, K.-F.; Braun, T.; Schneider-Ramelow, M.; Lang, K.D.
Konferenzbeitrag
2019Reduction of hazardous materials in electrical and electronic equipment
Deubzer, O.
Aufsatz in Buch
2019Reliability of substrate embedded rectifiers for high voltage applications
Meier, K.; Meyer, J.; Schein, F.-L.; Sirkeci, D.; Ostmann, A.; Oertel, E.; Westphal, H.; Lang, K.-D.; Bock, K.
Konferenzbeitrag
2019Schwingungsanalyse von Chipaufbauten mit Überhangstrukturen hinsichtlich der Bondbarkeit
Dobs, T.; Höfer, J.; Helmich, L.; Hunstig, M.; Lang, K.-D.
Konferenzbeitrag
2019Silbergesinterte Flip-Chip-Kontaktierungen zur Realisierung von hochtemperaturfähigen Sensorsystemen
Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2019State of product energy efficiency in Europe - Market insights from the new EU product registration database for energy labelling
Berwald, A.; Rückschloss, J.; Lang, K.-D.; Schischke, K.; Nissen, N.
Konferenzbeitrag
2019Towards a Microfabricated Flexible Graphene-Based Active Implant for Tissue Monitoring During Optogenetic Spinal Cord Stimulation
Velea, Andrada Iulia; Vollebregt, Sten; Hosman, Tim; Pak, Anna; Giagka, Vasiliki
Konferenzbeitrag
2019An Ultra High-Frequency 8-Channel Neurostimulator Circuit with 68% Peak Power Efficiency
Urso, A.; Giagka, V.; Dongen, M. van; Serdijn, W.A.
Zeitschriftenaufsatz
2019Ultra thin force and acceleration sensor embedded in flexible thin film substrates using thin chip handling, bonding and carrier release technologies
MacKowiak, P.; Erbacher, K.; Zoschke, K.; Al-Magazachi, S.; Bäuscher, M.; Schiffer, M.; Lang, K.-D.; Ngo, H.-D.
Konferenzbeitrag
2019Unidirectional data center interconnects enabled by the use of broken-symmetry gap plasmon resonators (BS-GPR)
Sirbu, B.; Tekin, T.; Weeber, J.C.; Dereux, A.; Markey, L.
Konferenzbeitrag
2019Universelle Stellplattform für die optische Charakterisierung und Bekopplung von photonischen Chips
Lewoczko-Adamczyk, W.; Brauda, D.; Böttger, G.; Schröder, H.
Konferenzbeitrag
2019Verfahren zur Herstellung eines elektronischen Bauelements und elektronisches Bauelement
Ehrhardt, Christian; Höfer, Jan; Schneider-Ramelow, Martin
Patent
2019Verwölbung in der Systemintegration- Status und zukünftige Herausforderungen
Wittler, O.; Dijk, M. van; Grams, A.; Huber, S.; Rost, F.; Walter, H.; Lang, K.-D.
Konferenzbeitrag
2019Very-Thin System-in-Package Technology for Structural Analysis
Hopsch, Fabian; Heinig, Andy; Böttcher, Mathias
Konferenzbeitrag
2019Vorrichtung zur Erfassung von Objekten
Becker, Karl-Friedrich; Georgi, Leopold; Tschoban, Christian; Hommes, Alexander; Ebberg, Alfred; Hülsmann, Axel; Hofmann, Ulrich; Wantoch, Thomas von
Patent
2019Warpage Investigation of PCB Embedding Technology - Determination of Relevant Modelling Parameters by Means of FEM and Experiments
Rost, F.; Huber, S.; Walter, H.; Dijk, M. van; Cramer, T.; Jaeschke, J.; Wittier, O.; Schneider-Ramelow, M.
Konferenzbeitrag
2019Where is the Sweet Spot for Panel Level Packaging?
Braun, T.; Becker, K.F.; Hölck, O.; Voges, S.; Wöhrmann, M.; Böttcher, L.; Töpper, M.; Stobbe, L.; Aschenbrenner, R.; Schneider-Ramelow, M.; Lang, K.D.
Konferenzbeitrag
20183D arranged reduced graphene oxide - polyethylene glycol - amine based biosensor platform for super-sensitive detection of procalcitonin
Grabbert, Niels; Fiedler, Markus; Meyer, Vera; Georgi, Leopold; Hoeppner, Katrin; Ferch, Marc; Marquardt, Krystan; Jung, Erik; Mackowiak, Piotr; Ngo, Ha-Duong; Lang, Klaus-Dieter
Konferenzbeitrag
20183D wire - a novel approach for 3D chips interconnection for harsh environment applications
Bickel, Jan; Pohl, Olaf; Ngo, Ha-Duong; Hu, Xiaodong; Weiland, Thomas; Mackowiak, Piotr; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Konferenzbeitrag
20185G mm Wave Networks Leveraging Enhanced Fiber-Wireless Convergence for High-Density Environments
Papaioannou, S.; Kalfas, G.; Vagionas, C.; Maniotis, P.; Miliou, A.; Pleros, N.; Neto, L.A.; Chanclor, P.; Raj-Ali, M.; Bakopoulos, P.; Caillaud, C.; Debregeas, H.; Sirbu, M.B.; Eichhammer, Y.; Theodoropoulou, E.; Lyberopoulos, G.; Kartsakli, E.; Vardakas, J.; Torfs, G.; Yin, X.; Tsagkaris, K.; Demestichas, P.; Giannoulis, G.; Avramopoulos, H.; Lentaris, G.; Varvarigos, E.; Tafur Monroy, I.; Dayan, E.; Leiba, Y.; Dimogiannis, I.
Konferenzbeitrag
2018Accelerated Degradation of High Power Diode Lasers Caused by External Optical Feedback Operation
Kissel, H.; Leonhäuser, B.; Tomm, J.W.; Hempel, M.; Biesenbach, J.
Konferenzbeitrag
2018Adaptive camouflage panel in the visible spectral range
Schwarz, Alexander; Bartos, Berndt; Kunzer, Michael; Zechmeister, Martin; Pawlikowski, Jakub
Konferenzbeitrag
2018Adaptives Low-Power Sensor- und Funknetzwerk für Assistenzsysteme im Bereich altersgerechtes Wohnen (ALFA)
Al-Batol, Muaadh; Bickel, Jan; Ngo, Ha Duong
Aufsatz in Buch
2018Ag sintering - An alternative large area joining technology
Weber, C.; Hutter, M.
Konferenzbeitrag
2018Alterungsphänomene beim Al-Drahtbonden mit semiautokatalytisch abgeschiedenem Gold auf chemisch Ni-Schichten
Fischer, Felix; Schmidt, R.; Schneider-Ramelow, M.; Schmitz, S.; Ngo, H.-D.; Sitte, N.
Konferenzbeitrag
2018Analytical modeling and measurement of vias in PCB-Technology up to 20 GHz
Perlwitz, P.; Curran, B.; Tschoban, C.; Ndip, I.; Pötter, H.; Lang, K.-D.
Konferenzbeitrag
2018Antennenmessplatz
Curran, Brian; Großer, Volker; Huhn, Max; Lang, Klaus-Dieter; Ndip, Ivan
Patent
2018Antennenvorrichtung mit Bonddrähten
Ndip, Ivan
Patent
2018Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
Ndip, Ivan
Patent
2018Assembly-Line-Compatible Electromagnetic Characterization of Antenna Substrates for Wearable Applications using Polynomial Chaos
Deckmyn, T.; Rossi, M.; Agneessens, S.; Rogier, H.; Ginste, D.V.
Konferenzbeitrag
2018Die attach for high power VCSEL array systems
Goullon, L.; Weber, C.; Hutter, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Bändchenbondantennen
Ndip, Ivan
Patent
2018Building Capacities for Transdisciplinary Research
Jaeger-Erben, M.; Kramm, J.; Sonnberger, M.; Völker, C.; Albert, C.; Graf, A.; Hermans, K.; Lange, S.; Santarius, T.; Schröter, B.; Sievers-Glotzbach, S.; Winzer, J.
Zeitschriftenaufsatz
2018Can Bond Wires really be used as Antennas?
Ndip, I.; Becker, K.F.; Brandenburger, F.; Le, T.H.; Huhn, M.; Bauer, J.; Koch, M.; Hempel, M.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Catastrophic Optical Damage of GaN-Based Diode Lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.; Acklin, B.
Zeitschriftenaufsatz
2018Challenges for Miniaturised Energy Harvesting Sensor Systems
Rusu, C.; Bader, S.; Oelmann, B.; Alvandpour, A.; Enoksson, P.; Braun, T.; Tiedke, S.; Dal Molin, R.; Ferin, G.; Torvinen, P.; Liljeholm, J.
Konferenzbeitrag
2018Channel Characterization for Chip-scale Wireless Communications within Computing Packages
Timoneda, X.; Cabellos-Aparicio, A.; Manessis, D.; Alarcon, E.; Abadal, S.
Konferenzbeitrag
2018Characterisation of Cu/Cu bonding using self-assembled monolayer
Lykova, M.; Panchenko, I.; Künzelmann, U.; Reif, J.; Geidel, M.; Wolf, M.J.; Lang, K.-D.
Zeitschriftenaufsatz
2018Characteristics of Li-ion micro batteries fully batch fabricated by micro-fluidic MEMS packaging
Hahn, R.; Ferch, M.; Kyeremateng, N.A.; Hoeppner, K.; Marquardt, K.; Elia, G.A.
Zeitschriftenaufsatz
2018Characterization of low temperature Cu/In bonding for fine-pitch interconnects in three-dimensional integration
Panchenko, I.; Bickel, S.; Meyer, J.; Mueller, M.; Wolf, J.M.
Zeitschriftenaufsatz
2018Characterization of self-assembled monolayers for CuCu bonding technology
Lykova, M.; Langer, E.; Hinrichs, K.; Panchenko, I.; Meyer, J.; Künzelmann, U.; Wolf, M.J.; Lang, K.D.
Zeitschriftenaufsatz
2018Codesign for the integration of energy harvesters and antennas for highly integrated cyber physical systems (CPS)
Maaß, U.; Hefer, J.; Brockmann, C.; Reinhardt, D.; Lang, K.-D.
Konferenzbeitrag
2018A comparative analysis of 5G mmWave antenna arrays on different substrate technolgies
Ndip, I.; Le, T.H.; Schwanitz, O.; Lang, K.-D.
Konferenzbeitrag
2018Comparison of catastrophic optical damage events in GaAs- and GaN-based diode lasers
Tomm, J.W.; Kernke, R.; Mura, G.; Vanzi, M.; Hempel, M.
Konferenzbeitrag
2018Comparison of temperature sensitive electrical parameter based methods for junction temperature determination during accelerated aging of power electronics
Wuest, F.; Trampert, S.; Janzen, S.; Straube, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2018Corrosion behaviour of sintered silver under maritime environmental conditions
Kolbinger, E.; Wagner, S.; Gollhardt, A.; Rämer, O.; Lang, K.-D.
Zeitschriftenaufsatz
2018Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Bickel, S.; Höhne, R.; Panchenko, I.; Meyer, J.; Wolf, M.J.
Konferenzbeitrag
2018Cu-In fine-pitch-interconnects: Influence of processing conditions on the interconnection quality
Bickel, S.; Sen, S.; Meyer, J.; Panchenko, I.; Wolf, M.J.
Konferenzbeitrag
2018Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array
Kumar, A.; Schulz, M.; Sheva, S.; Keller, J.; Bader, V.; Wöhrmann, M.; Bauer, J.; May, D.; Wunderle, B.
Konferenzbeitrag
2018Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
Schröder, H.; Neitz, M.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Design and application of a high-g piezoresistive acceleration sensor for high-impact application
Hu, Xiaodong; Mackowiak, Piotr; Bäuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong
Zeitschriftenaufsatz
2018Design and Custom Fabrication of a Smart Temperature Sensor for an Organ-on-a-chip Platform
Ponte, R.; Giagka, V.; Serdijn, W.A.
Konferenzbeitrag
2018Determination of relevant material behavior for use in stretchable electronics
Walter, H.; Grams, A.; Seckel, M.; Löher, T.; Wittler, O.; Lang, K.D.
Konferenzbeitrag
2018Determination of Stress-Strain Properties Combining Small-Depth Nanoindentation and Numerical Simulation
Kuttler, S.; Walter, H.; Grams, A.; Schneider-Ramelow, M.; Huber, S.
Konferenzbeitrag
2018Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz
Curran, B.; Reyes, J.; Tschoban, C.; Höfer, J.; Grams, A.; Wüst, F.; Hutter, M.; Leiß, J.; Martínez-Vázquez, M.; Baggen, R.; Ndip, I.; Lang, K.-D.
Zeitschriftenaufsatz
2018Development of a high resolution magnetic field position sensor system based on a through silicon via first integration concept
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Konferenzbeitrag
2018Development of micro dispense and jetting process of battery electrodes for the fabrication of substrate integrated micro batteries
Hahn, R.; Ferch, M.; Tribowski, K.; Hoeppner, K.; Marquardt, K.; Lang, K.-D.
Konferenzbeitrag
2018Differential-Line Characterization Using Mixed-Port Scattering Parameters
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, J.
Konferenzbeitrag
2018Double-wired bond wire antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Brunschwiler, T.; Steller, W.; Oppermann, H.; Kleff, J.; Robertson, S.; Mroßko, R.; Keller, J.; Schlottig, G.
Konferenzbeitrag
2018Ecodesign of Personal Computers: An Analysis of the Potentials of Material Efficiency Options
Tecchio, P.; Ardente, F.; Marwede, M.; Clemm, C.; Dimitrova, G.; Mathieux, F.
Zeitschriftenaufsatz
2018Effects of Glob Top on mmWave Bond Wire Antennas
Ndip, I.; Huhn, M.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications
Mackowiak, Piotr; Abdallah, Rachid; Wilke, Martin; Patel, Jash; Ashraf, Huma; Buchanan, Keith; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Ngo, Ha-Duong
Zeitschriftenaufsatz
2018Electrical micro-heating structures on glass created by laser ablation
Neitz, Marcel; Böttger, Gunnar; Queisser, Marco; Arndt-Staufenbiel , Norbert; Schneider-Ramelow, Martin
Konferenzbeitrag
2018Elektronisches Modul mit integrierter Antenne und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Elektronisches Modul und Verfahren zu seiner Herstellung
Böttcher, Lars; Kosmider, Stefan; Löher, Thomas; Ostmann, Andreas
Patent
2018Energy autarkic wireless sensor node for reliable long-term exposure to domestic waste water in a sewage system
Leverenz, E.; Becker, K.-F.; Koch, M.; Straube, S.; Pötter, H.; Lang, K.-D.
Konferenzbeitrag
2018Energy harvesting and conversion - applications of piezoelectric transformer and transducer MEMS
Radecker, Matthias; Kunzmann, Jan; Quenzer, Hans-Joachim; Gu-Stoppel, Shan-Shan; Yang, Yujia
Vortrag
2018An Energy-efficient, Inexpensive, Spinal Cord Stimulator with Adaptive Voltage Compliance for Freely Moving Rats
Olafsdottir, Gudrun Erla; Serdijn, Wouter A.; Giagka, Vasiliki
Konferenzbeitrag
2018The Evolution of Panel Level Packaging
Aschenbrenner, Rolf; Töpper, M.; Braun, Tanja; Ostmann, A.
Konferenzbeitrag
2018Experimental Demonstration of Temperature Sensing with Packaged Glass Bottle Microresonators
Herter, Jonas; Wunderlich, V.; Janeczka, C.; Zamora, V.
Zeitschriftenaufsatz
2018Fabrication of a High Precision Magnetic Position Sensor based on a Through Silicon Via First Approach
Zoschke, Kai; Oppermann, H.; Paul, J.; Knoll, H.; Braun, F.-J.; Saumer, M.; Theis, M.; Frank, P.; Lenkl, A.; Klose, F.
Konferenzbeitrag
2018Fan-out wafer level packaging for 5G and mm-Wave applications
Braun, Tanja; Becker, K.-F.; Hoelck, O.; Kahle, R.; Woehrmann, M.; Toepper, M.; Ndip, I.; Maass, U.; Tschoban, C.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.
Konferenzbeitrag
2018First responders occupancy, activity and vital signs monitoring - SAFESENS
O’Flynn, Brendan; Walsh, Michael; Brahmi, I.H.; Oudenhoven, Jos; Nackaerts, Axel; Pereira, Eduardo M.; Agrawal, Piyush; Fuchs, Tino; Braun, Tanja; Lang, Klaus-Dieter; Dils, Christian
Zeitschriftenaufsatz
2018Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects
Vernoux, Christian; Chen, Yiting; Markey, Laurent; Spärchez, Cosmin; Arocas, Juan; Felder, Thorsten; Neitz, Marcel; Brusberg, Lars; Weeber, Jean-Claude; Bozhevolnyi, Sergey I.; Dereux, Alain
Zeitschriftenaufsatz
2018Flux-induced porous structures in Cu-SnAg solidliquid-interdiffusion microbump interconnects
Meyer, J.; Upasani, P.J.; Bickel, S.; Panchenko, I.; Wolf, M.J.
Konferenzbeitrag
2018Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Jahresbericht 2018
 
Jahresbericht
2018Frequency-modulated laser ranging sensor with closed-loop control
Müller, F.M.; Böttger, G.; Janeczka, C.; Arndt-Staufenbiel, N.; Schröder, H.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
Zoschke, Kai; Güttler, M.; Böttcher, L.; Grübl, A.; Husmann, D.; Schemmel, J.; Meier, K.-H.; Ehrmann, O.
Konferenzbeitrag
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Konferenzbeitrag
2018Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
Zoschke, Kai; Eichhammer, Y.; Oppermann, H.; Manier, C.-A.; Dijk, M. van; Weber, C.; Hutter, M
Konferenzbeitrag
2018High Density Interconnect Processes for Panel Level Packaging
Ostmann, A.; Schein, F.-L.; Dietterle, M.; Kunz, M.; Lang, K.-D.
Konferenzbeitrag
2018High temperature encapsulation for smart power devices
Becker, K.-F.; Thomas, T.; Obst, M.; Bauer, J.; Braun, T.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Höchste Datenraten mittels Glasinterposertechnologie
Neitz, Marcel; Wöhrmann, Markus; Schröder, Henning
Zeitschriftenaufsatz
2018Impact of multilayer stack-ups on bond wire antennas at millimetre-wave frequencies
Ndip, I.; Schneider-Ramelow, M.; Huhn, M.; Brandenburger, F.; Hempel, M.; Lang, K.-D.
Konferenzbeitrag
2018In-line metrology for Cu pillar applications in interposer based packages for 2.5D integration
Panchenko, I.; Böttcher, M.; Wolf, J.M.; Kunz, M.; Lehmann, L.; Atanasova, T.; Wieland, M.
Konferenzbeitrag
2018In-situ characterization of thin polyimide films used for microelectronic packaging
Windrich, F.; Malanin, M.; Bittrich, E.; Schwarz, A.; Eichhorn, K.-J.; Voit, B.
Konferenzbeitrag
2018Influence of backbone structure, conversion and phenolic co-curing of cyanate esters on side relaxations, fracture toughness, flammability properties and water uptake and toughening with low molecular weight polyethersulphones
Uhlig, Christoph; Bauer, Monika; Bauer, Jörg; Kahle, Olaf; Taylor, Ambrose C.; Kinloch, Anthony J.
Zeitschriftenaufsatz
2018Influence of the electrode nano/microstructure on the electrochemical properties of graphite in aluminum batteries
Greco, G.; Tatchev, D.; Hoell, A.; Krumrey, M.; Raoux, S.; Hahn, R.; Elia, G.A.
Zeitschriftenaufsatz
2018Investigation of high pressure Ag sintered joints manufactured with different tools
Kripfgans, J.; Weber, C.; Hutter, M.
Konferenzbeitrag
2018Investigation of low temperature bonding process using indium bumps
Fritzsch, Thomas; Kavianpour, F.; Rothermund, Mario; Oppermann, Hermann; Ehrmann, Oswin; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2018Kombinationsantenne
Ndip, Ivan
Patent
2018Laser-assisted patterning of double-sided adhesive tapes for optofluidic chip integration
Zamora, V.; Janeczka, C.; Arndt-Staufenbiel, N.; Havlik, G.; Queisser, M.; Schröder, H.
Konferenzbeitrag
2018Laser-induced forward transfer of aluminium particles in different gaseous environment
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Lead-free piezoelectrics - The environmental and regulatory issues
Bell, A.J.; Deubzer, O.
Zeitschriftenaufsatz
2018Lifetime modelling and geometry optimization of meander tracks in stretchable electronics
Grams, A.; Kuttler, S.; Löher, T.; Walter, H.; Wittier, O.; Lang, K.-D.
Konferenzbeitrag
2018Low‐Polarization Lithium-Oxygen Battery Using [DEME][TFSI] Ionic Liquid Electrolyte
Ulissi, U.; Elia, G.A.; Jeong, S.; Müller, F.; Reiter, J.; Tsiouvaras, N.; Sun, Y.-K.; Scrosati, B.; Passerini, S.; Hassoun, J.
Zeitschriftenaufsatz
2018Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks
Vereshchagina, E.; Poppe, E.; Schjolberg-Henriksen, K.; Wöhrmann, M.; Moe, S.
Konferenzbeitrag
2018Microfluidic Interposer for High Performance Fluidic Chip Cooling
Steller, W.; Windrich, F.; Bremner, D.; Robertson, S.; Mroßko, R.; Keller, J.; Brunschwiler, T.; Schlottig, G.; Oppermann, H.; Wolf, M.J.; Lang, K.-D.
Konferenzbeitrag
2018Millimeter-Wave Propagation within a Computer Chip Package
Timoneda, X.; Abadal, S.; Cabellos-Aparicio, A.; Manessis, D.; Zhou, J.; Franques, A.; Torrellas, J.; Alarcon, E.
Konferenzbeitrag
2018Modeling and analysis of the impact of reference planes of quasi half loop bond wire antennas
Ndip, I.; Le, T.H.; Lang, K.-D.
Konferenzbeitrag
2018Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
Ndip, Ivan; Ostmann, Andreas
Patent
2018Multi sensor node for long-term wireless measurement of density, pH value and temperature in silage for bio gas
Arnold, P.; Tschoban, C.; Heuer, K.; Rochlitzer, R.; Thuenen, T.; Lang, K.-D.
Konferenzbeitrag
2018Nanowires in electronics packaging
Fiedler, S.; Zwanzig, M.; Schmidt, R.; Scheel, W.
Aufsatz in Buch
2018Narrow linewidth micro-integrated high power diode laser module for deployment in space
Christopher, H.; Arar, B.; Bawamia, A.; Kürbis, C.; Lewoczko-Adamczyk, W.; Schiemangk, M.; Smol, R.; Wicht, A.; Peters, A.; Tränkle, G.
Konferenzbeitrag
2018Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise
Engin, A.E.; Ndip, I.; Lang, K.-D.; Aguirre, G.
Zeitschriftenaufsatz
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018A Novel Low Cost Wireless Incontinence Sensor System (Screen- Printed Flexible Sensor System) for Wireless Urine Detection in Incontinence Materials
Ngo, Ha-Duong; Hoang, Thanh Hai; Bäuscher, Manuel; Mackowiak, Piotr; Grabbert, Nils; Weiland, Thomas; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Grudno, Jens
Zeitschriftenaufsatz
2018On the Radiation Characteristics of Full-Loop, Half-Loop and Quasi Half-Loop Bond Wire Antennas
Ndip, I.; Lang, K.-D.; Reichl, H.; Henke, H.
Zeitschriftenaufsatz
2018Optimization parameters for laser-induced forward transfer of Al and Cu on Si-wafer substrate
Azhdast, M.H.; Eichler, H.J.; Lang, K.D.; Glaw, V.
Konferenzbeitrag
2018Optimized Thermoforming Process for Conformable Electronics
Kallmayer, C.; Schaller, F.; Löher, T.; Haberland, J.; Kayatz, F.; Schult, A.
Konferenzbeitrag
2018Packaging for high frequency and reliability
Folk, E.; Ndip, I.
Zeitschriftenaufsatz
2018Packaging meets heterogeneous integration driving direction for advanced system in packages
Wolf, M.J.; Steller, W.; Lang, K.-D.
Konferenzbeitrag
2018Panel Level Packaging: A View Along the Process Chain
Braun, T.; Becker, K.-F.; Hölck, O.; Kahle, R.; Wöhrmann, M.; Böttcher, L.; Topper, M.; Stobbe, L.; Zedel, H.; Aschenbrenner, R.; Voges, S.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Parameter driven monitoring for a flip-chip LED module under power cycling condition
Magnien, J.; Mitterhuber, L.; Rosc, J.; Schrank, F.; Hörth, S.; Hutter, M.; Defregger, S.; Kraker, E.
Zeitschriftenaufsatz
2018Piezoresistive pressure sensors for applications in harsh environments - a roadmap
Ngo, Ha Duong; Ehrmann, Oswin; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Realizing flexible bioelectronic medicines for accessing the peripheral nerves - technology considerations
Giagka, Vasiliki; Serdijn, Wouter A.
Zeitschriftenaufsatz
2018Recent developments in panel level packaging
Braun, T.; Billaud, M.; Zedel, H.; Stobbe, L.; Becker, K.-F.; Hoelck, O.; Wöhrmann, M.; Boettcher, L.; Töpper, M.; Aschenbrenner, R.; Voges, S.; Lang, K.-D.; Schneider-Ramelow, M.
Konferenzbeitrag
2018Roles and Requirements of Electronic Packaging in 5G
Ndip, I.; Lang, K.-D.
Konferenzbeitrag
2018Roughness measurements of Al and Cu particles in Laser-Induced forward transferring process
Azhdast, M.H.; Eichler, H.J.; Lang, K.-D.; Glaw, V.; Kossatz, M.
Konferenzbeitrag
2018Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensors
Reinecke, Patrick; Putze, Marie-Theres; Georgi, Leopold; Kahle, Ruben; Kaiser, David; Hüger, Daniel; Livshits, Pavel; Weidenmüller, Jens; Weimann, Thomas; Turchanin, Andrey; Braun, Tanja; Becker, Karl-Friedrich; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
Zeitschriftenaufsatz
2018Silicon micro piezoresistive pressure sensors
Ngo, Ha Duong; Mackowiak, Piotr; Ehrmann, Oswin; Lang, Klaus-Dieter
Aufsatz in Buch
2018Simulation and Electrical Characterization of a Novel 2D-Printed Incontinence Sensor with Conductive Polymer PEDOT:PSS for Medical Applications
Baeuscher, Manuel; Wang, B.; Hu, Xiaodong; Mackowiak, Piotr; Merchau, N.; Ehrmann, Oswin; Schneider-Ramelow, M.; Lang, Klaus-Dieter; Ngo, Ha Duong
Konferenzbeitrag
2018Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix
Wunderle, B.; May, D.; Ras, M.A.; Grosse, C.; Wöhrmann, M.; Bader, V.; Keller, J.
Konferenzbeitrag
2018Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor
Hu, Xiaodong; MacKowiak, P.; Zhang, Y.; Ehrmann, O.; Lang, K.-D.; Schneider-Ramelow, M.; Hansen, U.; Maus, S.; Gyenge, O.; Meng, M.; Ngo, H.-D.
Konferenzbeitrag
2018Surface treatment of gold bumps for thermocompression bonding with low temperature
Fröhlich, Juliane; Dietrich, Lothar; Oppermann, Hermann; Lang, Klaus-Dieter
Konferenzbeitrag
2018A technology toolbox concept to improve reliability evaluation
Hahn, D.; Straube, S.; Jerchel, K.; Olaf, W.; Lang, K.-D.
Konferenzbeitrag
2018Thermal Management of a Ka Band Satellite Communication Module Using Finite Element Models and Thermal Imaging
Grams, A.; Curran, B.; Kuttler, S.; Reyes, J.; Wüst, F.; Lang, K.-D.
Konferenzbeitrag
2018Thermal transient measurement and modelling of a power cycled flip-chip LED module
Mitterhuber, L.; Defregger, S.; Magnien, J.; Rosc, J.; Hammer, R.; Goullon, L.; Hutter, M.; Schrank, F.; Hörth, S.; Kraker, E.
Zeitschriftenaufsatz
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Konferenzbeitrag
2018Thin Glass Based Optical Sub-Assemblies for Embedding in Electronic Systems
Lewoczko-Adamczyk, W.; Böttger, G.; Schröder, H.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Brunschwiler, T.; Schlottig, G.; Sridhar, A.; Bezerra, P.; Ruch, P.; Ebejer, N.; Oppermann, H.; Kleff, J.; Steller, W.; Jatlaoui, M.; Voiron, F.; Pavlovic, Z.; McCloskey, P.; Bremner, D.; Parida, P.; Krismer, F.; Kolar, J.; Michel, B.
Konferenzbeitrag
2018Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module
Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R.
Konferenzbeitrag
2018Ultra-thin 50 um fan-out wafer level package: Development of an innovative assembly and de-bonding concept
Woehrmann, Markus; Braun, T.; Toepper, M.; Lang, K.-D.
Konferenzbeitrag
2018An ultrasonically powered and controlled ultra-high-frequency biphasic electrical neurostimulator
Tacchetti, Lucia; Serdijn, Wouter A.; Giakga, Vasiliki
Konferenzbeitrag
2018Universal test system for system embedded optical interconnect
Pitwon, Richard; Wang, Kai; Immonen, Marika; Schröder, Henning; Neitz, Marcel
Konferenzbeitrag
2018Using fluidic simulation for parameter optimization in compression molding of microelectronic packages
Dreissigacker, M.; Hoelck, O.; Raatz, S.; Bauer, J.; Braun, T.; Becker, K.-F.; Schneider-Ramelow, M.; Lang, K.-D.
Konferenzbeitrag
2018Verfahren zur Herstellung eines Packages und Package
Böttcher, Mathias; Wolf, Jürgen
Patent
2018Wafer level embedding technology for packaging of planar GaN half-bridge module in high power density conversion applications
Manier, Charles-Alix; Klein, Kirill; Wuest, Felix; Gernhardt, Robert; Oppermann, Hermann; Cussac, Philippe; Andzouana, Sophie; Mitova, Radoslava; Lang, Klaus-Dieter
Konferenzbeitrag
2018Wafer Level Package mit integrierten Antennen und Mittel zum Schirmen
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Package mit zumindest einem integrierten Antennenelement
Braun, Tanja; Ndip, Ivan
Patent
2018Wafer Level Packages mit integrierter oder eingebetteter Antenne
Braun, Tanja; Ndip, Ivan
Patent
2018Workshops der INFORMATIK 2018. Architekturen, Prozesse, Sicherheit und Nachhaltigkeit
: Czarnecki, Christian; Brockmann, Carsten; Sultanow, Eldar; Koschmider, Agnes; Selzer, Annika
Tagungsband