Fraunhofer-Gesellschaft

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Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
2021Characterization of Capacitive Micromachined Ultrasound Transducer (Cmut) for Targeted Applications in Harsh Environments
Saeidi, N.; Selvam, K.F.R.G.M.; Souza Tortato, F. de; Satwara, M.; Wiemer, M.
Konferenzbeitrag
2021Corrigendum to "A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups" [Microporous Mesoporous Mater. 306 (2020) 110434]
Rasadujjaman, M.; Wang, Y.; Zhang, L.; Naumov, S.; Attallah, A.G.; Liedke, M.O.; Koehler, N.; Redzheb, M.; Vishnevskiy, A.S.; Seregin, D.S.; Wu, Y.; Zhang, J.; Leu, J.; Wagner, A.; Vorotilov, K.A.; Schulz, S.E.; Baklanov, M.R.
Erratum
2021Digital Manufacturing Technologies for the Development of Smart Sensors and Electronics for Agro-Industrial systems
Fritsch, Marco; Kabla, Ayala; Kapadia, Sunil; Zichner, Ralf; Wissmeier, Lena; Shaly, Neil; Samotaev, Nikolay
Bericht
2021Dynamical characterisation of a miniaturised bulge tester for use at elevated temperatures
Zschenderlein, U.; Zhang, H.; Ecke, R.; Jöhrmann, N.; Wunderle, B.
Konferenzbeitrag
2021Finite element-based lifetime modelling of SAC solder joints in LED applications
Shaygi, M.; Li, M.; Lang, K.J.; Laux, H.; Wunderle, B.
Konferenzbeitrag
2021Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2020
 
Jahresbericht
2021Influence of the organic hole transport layer on the dynamics of quantum dot-based light-emitting diodes
Langenickel, J.; Weiß, A.; Martin, J.; Otto, T.; Kuhn, H.
Konferenzbeitrag
2021Large-scale fabrication of all-inkjet-printed resistors and WORM memories on flexible polymer films with high yield and stability
Ramon, E.; Sowade, E.; Martinez-Domingo, C.; Mitra, K.Y.; Alcalde, A.; Baumann, R.R.; Carrabina, J.
Zeitschriftenaufsatz
2021Lifetime modelling of sintered silver interconnected power devices by FEM and experiment
Mathew, A.; Dudek, R.; Otto, A.; Scherf, C.; Rzepka, S.; Subbiah, N.; Rane, K.A.; Wilde, J.
Konferenzbeitrag
2021Low-power emerging memristive designs towards secure hardware systems for applications in internet of things
Du, Nan; Schmidt, Heidemarie; Polian, Ilia
Zeitschriftenaufsatz
2021Optimization of synthetic jet actuation by analytical modeling
Huber, M.; Zienert, A.; Weigel, P.; Schüller, M.; Berger, H.-R.; Schuster, J.; Otto, T.
Zeitschriftenaufsatz
2021A Parametric Simulative Study for Lifetime Prediction of Sintered Silver Die Attach under Different Accelerated Testing Conditions
Forndran, F.; Heilmann, J.; Metzler, M.; Leicht, M.; Wunderle, B.
Konferenzbeitrag
2021Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride
Meinel, K.; Stoeckel, C.; Melzer, M.; Zimmermann, S.; Forke, R.; Hiller, K.; Otto, T.
Zeitschriftenaufsatz
2021Prospects for application of ferroelectric manganites with controlled vortex density
Schmidt, H.
Zeitschriftenaufsatz
2021Reactive Bonding
Vogel, Klaus; Braun, Silvia; Hofmann, Christian; Weiser, Mathias; Wiemer, Maik; Otto, Thomas; Kuhn, Harald
Aufsatz in Buch
2021Simulations for nanoindentation on thin metal films and the potential influence of creep
Jöhrmann, N.; Ecke, R.; Wunderle, B.
Konferenzbeitrag
2021Smart sensor systems for extremely harsh environments
Kappert, Holger; Schopferer, Sebastian; Döring, Ralf; Ziesche, Steffen; Olowinsky, Alexander; Naumann, Falk; Jaegle, Martin; Ostmann, Andreas
Konferenzbeitrag
2021Special issue: International conference on applied system innovation (ICASI 2018)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B.
Editorial
2021Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System
Dudek, R.; Döring, R.; Rzepka, S.; Gromala, P.; Schindele, J.; Vandevelde, B.
Konferenzbeitrag
2021Tilt- and warpage measurement of bonded dies as an inline quality assessment tool
May, D.; Heilmann, J.; Boschman, E.; Abo Ras, M.; Wunderle, B.
Konferenzbeitrag
2021Using AFM Measurements for Failure Indication during High-Cycle Fatigue Testing of thin Metal Films on MEMS Cantilevers
Osipova, V.; Jöhrmann, N.; Heilmann, J.; May, D.; Arnold, J.; Bieniek, T.; Pufall, R.; Wunderle, B.
Konferenzbeitrag
20202D Scanning Micromirror with Large Scan Angle and Monolithically Integrated Angle Sensors Based on Piezoelectric Thin Film Aluminum Nitride
Meinel, K.; Melzer, M.; Stoeckel, C.; Shaporin, A.; Forke, R.; Zimmermann, S.; Hiller, K.; Otto, T.; Kuhn, H.
Zeitschriftenaufsatz
2020Advanced Packaging Cost Reduction by Selective Copper Metallization
Mavliev, R.; Gottfried, K.; Rhoades, R.
Konferenzbeitrag
2020All-Printed Piezoresistive Sensor Matrix with Organic Thin-Film Transistors as a Switch for Crosstalk Reduction
Correia, V.; Oliveira, J.; Perinka, N.; Costa, P.; Sowade, E.; Mitra, K.Y.; Baumann, R.R.; Lanceros-Mendez, S.
Zeitschriftenaufsatz
2020Analysen der Lotermüdung an montierten Testbaugruppen unter Thermowechselbeanspruchungen
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Doering, R.; Scheiter, L.; Tegehall, P.-E.; Zhang, M.; Ortmann, R.W.
Konferenzbeitrag
2020Analysis of Solder Fatigue on Mounted Test Assemblies under Thermal Cycling Loads
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Scheiter, L.; Zhang, M.; Ortmann, R.W.
Konferenzbeitrag
2020Autonomous Event Driven Model of Second Order Voltage Switched Charge Pump PLL
Ali, E.; Haddad, F.; Rahajandraibe, W.; Nizamani, N.; Hangmann, C.; Hedayat, C.
Zeitschriftenaufsatz
2020Calculation technique of diffuse reflectance spectra using an ensemble of damped harmonic oscillators model for substances identification
Anfimov, D.R.; Fufurin, I.L.; Golyak, I.S.; Tabalina, A.S.; Kurth, S.
Konferenzbeitrag
2020Characteristics of the Results of a Theoretical Analysis of Energy and Electron Transfer Processes in Multimolecular Nanoassemblies
Zenkevich, E.I.; Kilin, D.; Borczyskowski, C. von; Zahn, D.R.T.
Zeitschriftenaufsatz
2020Charged domains in ferroelectric, polycrystalline yttrium manganite thin films resolved with scanning electron microscopy
Rayapati, V.R.; Bürger, D.; Du, N.; Kowol, C.; Blaschke, D.; Stöcker, H.; Matthes, P.; Patra, R.; Skorupa, I.; Schulz, S.E.; Schmidt, H.
Zeitschriftenaufsatz
2020Co-sputtering of Al1−xScxN thin films on Pt(111): a characterization by Raman and IR spectroscopies
Solonenko, D.; Lan, C.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T.
Zeitschriftenaufsatz
2020Control of magneto-optical properties of cobalt-layers by adsorption of α-helical polyalanine self-assembled monolayers
Sharma, A.; Matthes, P.; Soldatov, I.; Arekapudi, S.S.P.K.; Böhm, B.; Lindner, M.; Selyshchev, O.; Thi Ngoc Ha, N.; Mehring, M.; Tegenkamp, C.; Schulz, S.E.; Zahn, D.R.T.; Paltiel, Y.; Hellwig, O.; Salvan, G.
Zeitschriftenaufsatz
2020Cover Feature: Ferrocenyl‐Pyrenes, Ferrocenyl‐9,10‐Phenanthrenediones, and Ferrocenyl‐9,10‐Dimethoxyphenanthrenes
Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2020Crystallization of optically thick films of CoxFe 80-xB20
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Hellwig, O.; Kowol, C.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2020Design of a synthetic jet actuator for flow separation control
Weigel, P.; Schüller, M.; Gratias, A.; Lipowski, M.; Meer, T. ter; Bardet, M.
Zeitschriftenaufsatz
2020A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups
Rasadujjaman, M.; Wang, Y.; Zhang, L.; Naumov, S.; Attallah, A.G.; Liedke, M.O.; Koehler, N.; Redzheb, M.; Vishnevskiy, A.S.; Seregin, D.S.; Wu, Y.; Zhang, J.; Leu, J.; Wagner, A.; Vorotilov, K.A.; Schulz, S.E.; Baklanov, M.R.
Zeitschriftenaufsatz
2020Determining adhesion of critical interfaces in microelectronics - A reverse Finite Element Modelling approach based on nanoindentation. Part I
Reuther, G.M.; Albrecht, J.; Pufall, R.; Dudek, R.; Rzepka, S.
Konferenzbeitrag
2020Disturbing-free determination of yeast concentration in DI water and in glucose using impedance biochips
Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Blaschke, D.; Schmidt, H.
Zeitschriftenaufsatz
2020Far-field prediction combining simulations with near-field measurements for EMI assessment of PCBs
Schroeder, D.; Lange, S.; Hangmann, C.; Hedayat, C.
Aufsatz in Buch
2020Ferrocenyl-Pyrenes, Ferrocenyl-9,10-Phenanthrenediones, and Ferrocenyl-9,10-Dimethoxyphenanthrenes: Charge-Transfer Studies and SWCNT Functionalization
Preuß, A.; Notz, S.; Kovalski, E.; Korb, M.; Blaudeck, T.; Hu, X.; Schuster, J.; Miesel, D.; Rüffer, T.; Hildebrandt, A.; Schreiter, K.; Spange, S.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2020Finite Element Simulations and Raman measurements to investigate thermomechanical stress in GaN-LEDs
Conti, F.; Liu, E.; Bhogaraju, S.K.; Wunderle, B.; Elger, G.
Konferenzbeitrag
2020Fluid flow generator
Bäcker, Dennis; Lipowski, Mathias
Patent
2020Formation and crystallographic orientation of NiSi2-Si interfaces
Fuchs, Florian; Bilal Khan, Muhammad; Deb, Dipjyoti; Pohl, Darius; Schuster, Jörg; Weber, Walter M.; Mühle, Uwe; Löffler, Markus; Georgiev, Yordan M.; Erbe, Artur; Gemming, Sibylle
Zeitschriftenaufsatz
2020Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2019
 
Jahresbericht
2020Gate Spacer Investigation for Improving the Speed of High-Frequency Carbon Nanotube-Based Field-Effect Transistors
Hartmann, M.; Tittmann-Otto, J.; Böttger, S.; Heldt, G.; Claus, M.; Schulz, S.E.; Schröter, M.; Hermann, S.
Zeitschriftenaufsatz
2020The Impact of Wettability and Surface Roughness on Fluid Displacement and Capillary Trapping in 2‐D and 3‐D Porous Media. 2. Combined Effect of Wettability, Surface Roughness, and Pore Space Structure on Trapping Efficiency in Sand Packs and Micromodels
Zulfiqar, B.; Vogel, H.; Ding, Y.; Golmohammadi, S.; Kuechler, M.; Reuter, D.; Geistlinger, H.
Zeitschriftenaufsatz
2020Increased static dielectric constant in ZnMnO and ZnCoO thin films with bound magnetic polarons
Vegesna, S.V.; Bhat, V.J.; Bürger, D.; Dellith, J.; Skorupa, I.; Schmidt, O.G.; Schmidt, H.
Zeitschriftenaufsatz
2020Induktives Bonden in der Mikrosystemtechnik
Fröhlich, A.; Hofmann, C.
Zeitschriftenaufsatz
2020Induktives Fügen in der Mikrosystemtechnik
Hofmann, C.; Fröhlich, A.; Kroll, M.
Zeitschriftenaufsatz
2020Inkjet Printing of Bioresorbable Materials for Manufacturing Transient Microelectronic Devices
Mitra, K.Y.; Willert, A.; Chandru, R.; Baumann, R.R.; Zichner, R.
Zeitschriftenaufsatz
2020Investigation of the Surface Equivalence Principle on a Metal Surface for a Near-Field to Far-Field Transformation by the NFS3000
Lange, S.; Schroeder, D.; Hedayat, C.; Hangmann, C.; Otto, T.; Hilleringmann, U.
Konferenzbeitrag
2020Late-Stage Customization in Volume Production of Organic Photovoltaics
Vishnu Subramaniam, S.; Wiel, B. Van Der; Sauermann, T.; Kutsarov, D.; Schilinsky, P.; Pätzold, R.; Baumann, R.R.; Meier, S.B.
Zeitschriftenaufsatz
2020The Limits of the Post‐Growth Optimization of AlN Thin Films Grown on Si(111) via Magnetron Sputtering
Solonenko, D.; Schmidt, C.; Stoeckel, C.; Hiller, K.; Zahn, D.R.T.
Zeitschriftenaufsatz
2020Macroheterocyclic Compounds - a Key Building Block in New Functional Materials and Molecular Devices
Koifman, O.I.; Ageeva, T.A.; Beletskaya, I.P.; Averin, A.D.; Yakushev, A.A.; Tomilova, L.G.; Dubinina, T.V.; Tsivadze, A.Y.; Gorbunova, Y.G.; Martynov, A.G.; Konarev, D.V.; Khasanov, S.S.; Lyubovskaya, R.N.; Lomova, T.N.; Korolev, V.V.; Zenkevich, E.I.; Blaudeck, T.; Borczyskowski, C. von; Zahn, D.R.T.; Mironov, A.F.; Bragina, N.A.; Ezhov, A.V.; Zhdanova, K.A.; Stuzhin, P.A.; Pakhomov, G.L.; Rusakova, N.V.; Semenishyn, N.N.; Smola, S.S.; Parfenyuk, V.I.; Vashurin, A.S.; Makarov, S.V.; Dereven’kov, I.A.; Mamardashvili, N.Z.; Kurtikyan, T.S.; Martirosyan, G.G.; Burmistrov, V.A.; Aleksandriiskii, V.V.; Novikov, I.V.; Pritmov, D.A.; Grin, M.A.; Suvorov, N.V.; Tsygankov, A.A.; Fedorov, A.Y.; Kuzmina, N.S.; Nyuchev, A.V.; Otvagin, V.F.; Kustov, A.V.; Belykh, D.V.; Berezin, D.B.; Solovieva, A.B.; Timashev, P.S.; Milaeva, E.R.; Gracheva, Y.A.; Dodokhova, M.A.; Safronenko, A.V.; Shpakovsky, D.B.; Syrbu, S.A.; Gubarev, Y.A.; Kiselev, A.N.; Koifman, M.O.; Lebedeva, N.S.; Yurina, E.S.
Zeitschriftenaufsatz
2020Microbial Community Distribution and Core Microbiome in Successive Wound Grades of Individuals with Diabetic Foot Ulcers
Jnana, Apoorva; Muthuraman, Vigneshwaran; Varghese, Vinay Koshy; Chakrabarty, Sanjiban; Murali, Thokur Sreepathy; Ramachandra, Lingadakai; Shenoy, Kallya Rajgopal; Rodrigues, Gabriel Sunil; Prasad, Seetharam Shiva; Dendukuri, Dhananjaya; Morschhauser, A.; Nestler, Joerg; Peter, Harald; Bier, Frank F.; Satyamoorthy, Kapaettu
Zeitschriftenaufsatz
2020Nanoindentation as part of material characterization of thin metal films
Jöhrmann, N.; Ecke, R.; Wunderle, B.
Konferenzbeitrag
2020On the feasibility of fan-out wafer-level packaging of capacitive micromachined ultrasound transducers (CMUT) by using inkjet-printed redistribution layers
Roshanghias, A.; Dreissigacker, M.; Scherf, C.; Bretthauer, C.; Rauter, L.; Zikulnig, J.; Braun, T.; Becker, K.-F.; Rzepka, S.; Schneider-Ramelow, M.
Zeitschriftenaufsatz
2020On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes
Haase, M.; Melzer, M.; Lang, N.; Ecke, R.; Zimmermann, S.; Helden, J.-P.H. van; Schulz, S.E.
Zeitschriftenaufsatz
2020Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y.
Zeitschriftenaufsatz
2020Parylene C Based Adhesive Bonding on 6" and 8" Wafer Level for the Realization of Highly Reliable and Fully Biocompatible Microsystems
Selbmann, F.; Baum, M.; Meinecke, C.; Wiemer, M.; Otto, T.; Joseph, Y.
Konferenzbeitrag
2020PHM features for large circuit boards to be implemented into electric drivetrain applications
Otto, A.; Kaulfersch, E.; Singh, P.; Romano, C.; Hildebrandt, M.; Rzepka, S.
Konferenzbeitrag
2020A Platform for Fostering Industry-Academia Collaboration
Otto, T.
Zeitschriftenaufsatz
2020Power Cycling of SiC-MOSFET Single-Chip Modules with Additional Measurement Cycles for Life End Determination
Wagner, F.; Reber, G.; Rittner, M.; Guyenot, M.; Nitzsche, M.; Wunderle, B.
Konferenzbeitrag
2020Process monitoring and impulse detection in face milling using capacitive acceleration sensors based on MEMS
Clauß, B.; Meinecke, C.; Günther, W.; Akthari, S.; Albers, J.; Forke, R.; Streit, P.; Reuter, D.; Schubert, A.
Zeitschriftenaufsatz
2020Quantifying the influence of graphene film nanostructure on the macroscopic electrical conductivity
Rizzi, L.; Wijaya, A.F.; Palanisamy, L.V.; Schuster, J.; Koehne, M.; Schulz, S.E.
Zeitschriftenaufsatz
2020Reliability Assessment of Ag Sintered Joints Using a SiC Semiconductor and Determination of Failure Mechanism in the Field of Power Electronics
Schaal, M.; Klingler, M.; Metais, B.; Grueninger, R.; Hoffmann, S.; Wunderle, B.
Konferenzbeitrag
2020Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
Dudek, R.; Anu, M.; Albrecht, J.; Scherf, C.; Rzepka, S.; Subbiah, N.; Wilde, J.
Konferenzbeitrag
2020Ruthenium(II) MOCVD Precursors for Phosphorus‐Doped Ruthenium Layer Formation
Preuß, A.; Tamuliene, J.; Madajska, K.; Szymanska, I.B.; Korb, M.; Rüffer, T.; Jeschke, J.; Melzer, M.; Bankwitz, J.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2020Selective Heat Input for Low Temperature Metallic Wafer Level Bonding
Wiemer, M.; Hofmann, C.; Vogel, K.
Zeitschriftenaufsatz
2020Selective induction heating of metallic microstructures for wafer-level MEMS packaging
Fröhlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kräusel, V.
Zeitschriftenaufsatz
2020Selective Metal Deposition to Increase Productivity
Rhoades, R.L.; Mavliev, R.; Gottfried, K.
Konferenzbeitrag
2020Stress Prognostics for Encapsulated Standard Packages by Neural Networks Using Data from in-situ Condition Monitoring during Thermal Shock Tests
Majd, M.; Meszmer, P.; Priscaru, A.; Gromala, P.J.; Wunderle, B.
Konferenzbeitrag
2020Synthesis of β-Ketoiminato Copper(II) Complexes and their Use in Copper Deposition
Preuß, A.; Korb, M.; Rüffer, T.; Bankwitz, J.; Georgi, C.; Jakob, A.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2020System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain
Doncker, R.W.de; Fuchs, L.; Hepp, M.; Luedecke, C.; Meyne, C.; Nisch, A.; Otto, A.; Reum, T.; Rzepka, S.; Strenger, C.; Uhlemann, A.; Vanegas, O.; Wondrak, W.
Konferenzbeitrag
2020The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
Gadhiya, G.; Rzepka, S.; Otto, T.; Kersjes, S.; Fernandes, F.
Konferenzbeitrag
2020Theoretical Analysis of Energy and Electron Transfer Processes in Multimolecular Nanoassemblies
Zenkevich, E.I.; Kilin, D.; Borczyskowski, C. von; Zahn, D.R.T.
Zeitschriftenaufsatz
2020Thermal kinetics of free volume in porous spin-on dielectrics: Exploring the network- and pore-properties
Attallah, A.G.; Koehler, N.; Liedke, M.O.; Butterling, M.; Hirschmann, E.; Ecke, R.; Schulz, S.E.; Wagner, A.
Zeitschriftenaufsatz
2020Thermomechanical stress in GaN-LEDs soldered onto Cu substrates studied using Finite Element Method and Raman spectroscopy
Liu, E.; Conti, F.; Bhogaraju, S.K.; Signorini, R.; Pedron, D.; Wunderle, B.; Elger, G.
Zeitschriftenaufsatz
2020Towards Bacteria Counting in DI Water of Several Microliters or Growing Suspension Using Impedance Biochips
Kiani, M.; Tannert, A.; Du, N.; Hübner, U.; Skorupa, I.; Bürger, D.; Zhao, X.; Blaschke, D.; Rebohle, L.; Cherkouk, C.; Neugebauer, U.; Schmidt, O.G.; Schmidt, H.
Zeitschriftenaufsatz
2020Tunable Magnetic Vortex Dynamics in Ion-Implanted Permalloy Disks
Ramasubramanian, L.; Kákay, A.; Fowley, C.; Yildirim, O.; Matthes, P.; Sorokin, S.; Titova, A.; Hilliard, D.; Böttger, R.; Hübner, R.; Gemming, S.; Schulz, S.E.; Kronast, F.; Makarov, D.; Fassbender, J.; Deac, A.
Zeitschriftenaufsatz
2020Verbesserte Prozessüberwachung durch hochsensitive CNT-Kraftaufnehmer
Bonitz, Jens; Hamm, Lucas; Müller, Peter; Hermann, Sascha
Zeitschriftenaufsatz
2020Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
Gadhiya, G.; Kuisma, H.; Cardoso, A.; Brämer, B.; Rzepka, S.; Otto, T.
Konferenzbeitrag
2020Wafer-level integration of self-aligned high aspect ratio silicon 3D structures using the MACE method with Au, Pd, Pt, Cu, and Ir
Franz, M.; Junghans, R.; Schmitt, P.; Szeghalmi, A.; Schulz, S.E.
Zeitschriftenaufsatz
2020Wafer-level vacuum-packaged translatory MEMS actuator with large stroke for NIR-FT spectrometers
Sandner, Thilo; Gaumont, Eric; Graßhoff, Thomas; Rieck, Andreas; Seifert, T.; Auböck, Gerald; Grahmann, Jan
Zeitschriftenaufsatz
2020Water-Based Primary Cell for Powering of Wireless Sensors
Petrov, D.; Hilleringmann, U.
Konferenzbeitrag
2020Zuverlässigkeitsstudien an silbergesinterten leistungselektronischen Modulen ohne Nutzung von DCB-Substraten
Subbiah, N.; Hamza, A.; Wilde, J.; Mathew, A.; Dudek, R.
Konferenzbeitrag
2019Accelerated Pump Out Testing for Thermal Greases
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Schacht, R.; Abo Ras, M.
Konferenzbeitrag
2019Advanced Characterization Methods for Electrical and Sensoric Components and Devices at the Micro and Nano Scales
Sheremet, E.; Meszmer, P.; Blaudeck, T.; Hartmann, S.; Wagner, C.; Ma, B.; Hermann, S.; Wunderle, B.; Schulz, S.E.; Hietschold, M.; Rodriguez, R.D.; Zahn, D.R.T.
Zeitschriftenaufsatz
2019Affordable and safe high performance vehicle computers with ultra-fast on-board ethernet for automated driving
Hager, M.; Gromala, P.; Wunderle, B.; Rzepka, S.
Konferenzbeitrag
2019Ar+ ions irradiation induced memristive behavior and neuromorphic computing in monolithic LiNbO3 thin films
Pan, X.; Shuai, Y.; Wu, C.; Zhang, L.; Guo, H.; Cheng, H.; Peng, Y.; Qiao, S.; Luo, W.; Wang, T.; Sun, X.; Zeng, H.; Zhang, J.; Zhang, W.; Ou, X.; Du, N.; Schmidt, H.
Zeitschriftenaufsatz
2019Assessment of FOWLP process dependent wafer warpage using parametric FE study
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas
Konferenzbeitrag
2019A β-ketoiminato palladium(II) complex for palladium deposition
Preuß, A.; Korb, M.; Rüffer, T.; Bankwitz, J.; Georgi, C.; Jakob, A.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2019BEoL Cracking Risks due to Manufacturing Introduced Residual Stresses
Auersperg, J.; Auerswald, E.; Vogel, D.; Rzepka, S.
Konferenzbeitrag
2019Beschleunigungssensoren mit großer Bandbreite und geringer Leistungsaufnahme für industrielle Anwendungen
Forke, R.; Hiller, K.; Küchler, M.; Hahn, S.; Weidlich, S.; Konietzka, S.; Motl, T.; Praedicow, A.; Otto, T.
Konferenzbeitrag
2019Carbon Nanotubes for Mechanical Sensor Applications
Wagner, C.; Blaudeck, T.; Meszmer, P.; Böttger, S.; Fuchs, F.; Hermann, S.; Schuster, J.; Wunderle, B.; Schulz, S.E.
Zeitschriftenaufsatz
2019Characterisation of MOS transistors as an electromechanical transducer for stress
Hafez, M.; Haas, S.; Loebel, K.-U.; Reuter, D.; Ramsbeck, M.; Schramm, M.; Horstmann, J.-T.; Otto, T.
Zeitschriftenaufsatz
2019A Combined Methodology to Include System Effects in Board-Level Stress Simulations
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Döring, R.; Scheiter, L.; Tröger, B.; Zhang, M.J.; Ortmann, R.W.
Konferenzbeitrag
2019Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results
Dudek, R.; Kreyssig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Frühauf, P.; Weigert, A.
Konferenzbeitrag
2019Compliance-current-modulated resistive switching with multi-level resistance states in single-crystalline LiNbO3 thin film
Pan, X.; Shuai, Y.; Wu, C.; Luo, W.; Sun, X.; Zeng, H.; Guo, H.; Yuan, Y.; Zhou, S.; Böttger, R.; Cheng, H.; Zhang, J.; Zhang, W.; Schmidt, H.
Zeitschriftenaufsatz
2019A Compound Control System for FR4-Based Electromagnetic Scanning Micrograting
Yu, F.; Wen, Q.; Lei, H.; Huang, L.; Wen, Z.
Zeitschriftenaufsatz
2019Computationally efficient simulation method for conductivity modeling of 2D-based conductors
Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E.
Zeitschriftenaufsatz
2019Concept of the 3rd Generation of Reliability for Electronic Smart Systems
Gromala, P.; Dietz, F.; Rzepka, S.; Han, B.
Konferenzbeitrag
2019The Creation of a Validated Scheme for the Automated Optimization of Systems in Package Designs
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven; Otto, Thomas; Kuisma, Heikki
Konferenzbeitrag
2019Design, Modeling, Fabrication, and Verification of New Multifunctional MEMS/NEMS Components
Freitag, M.; Sauppe, M.; Auerswald, C.; Kriebel, D.; Schmidt, H.; Voigt, S.; Arnold, B.; Markert, E.; Hahn, S.; Hiller, K.; Heinkel, U.; Mehner, J.
Zeitschriftenaufsatz
2019Developing a process to remove single silicon layers by atomic layer etching
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Konferenzbeitrag
2019Development of a multi-sensor system for condition monitoring and crash detection of machine tools with rotating spindles
Meinecke, C.; Clauss, B.; Albers, J.; Hoeller, H.; Streit, P.; Forke, R.; Weidlich, S.; Dittrich, C.; Stritzke, B.; Schubert, A.; Hiller, K.; Reuter, D.
Konferenzbeitrag
2019Development of synthetic jet actuator array for vortex-flow generation
Lipowski, M.; Bäcker, D.
Konferenzbeitrag
2019DNA digestion using immobilized dnase type I in a microfluidic cartridge
Graunitz, J.; Kuhn, S.; Stiehl, C.; Schneemann, M.; Morschhauser, A.; Peter, H.; Bier, F.; Nestler, J.
Konferenzbeitrag
2019Doctor blade system for the deposition of thin semiconducting films
Petrov, D.; Meyers, T.; Reker, J.; Hilleringmann, U.
Konferenzbeitrag
2019Electrically Controlled Actuation of Strained Nanomembranes
Enderlein, T.; Nestler, J.; Stiehl, C.; Morschhauser, A.; Otto, T.
Zeitschriftenaufsatz
2019Electroforming-free BiFeO3 switches for neuromorphic computing: Spike-timing dependent plasticity (STDP) and cycle-number dependent plasticity (CNDP)
Kiani, M.; Du, N.; Bürger, D.; Skorupa, I.; Ecke, R.; Schulz, S.E.; Schmidt, H.
Konferenzbeitrag
2019Electroforming-free Memristors for Hardware Security Primitives
Du, N.; Kiani, M.; Zhao, X.; Bürger, D.; Schmidt, O.G.; Ecke, R.; Schulz, S.E.; Schmidt, H.
Konferenzbeitrag
2019Electroforming-free resistive switching in yttrium manganite thin films by cationic substitution
Rayapai, V.R.; Bürger, D.; Du, N.; Patra, R.; Skorupa, I.; Blaschke, D.; Stöcker, H.; Matthes, P.; Schulz, S.E.; Schmidt, H.
Zeitschriftenaufsatz
2019Electron transport through NiSi2–Si contacts and their role in reconfigurable field-effect transistors
Fuchs, F.; Gemming, S.; Schuster, J.
Zeitschriftenaufsatz
2019Evaporation study based on micromodel experiments: Comparison of theory and experiment
Geistlinger, H.; Ding, Y.; Apelt, B.; Schlüter, S.; Küchler, M.; Reuter, D.; Vorhauer, N.; Vogel, H.‐J.
Zeitschriftenaufsatz
2019Exchange bias and diffusion processes in laser annealed CoFeB/IrMn thin films
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Busse, S.; Selyshchev, O.; Mack, P.; Exner, H.; Horn, A.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2019A flutter-based electromagnetic wind energy harvester: Theory and experiments
Lu, Z.; Wen, Q.; He, X.; Wen, Z.
Zeitschriftenaufsatz
2019FR4-based electromagnetic scanning micro-grating integrated with an angle sensor for a low-cost NIR micro-spectrometer
Wen, Q.; Lei, H.; Huang, J.; Yu, F.; Huang, L.; Zhang, J.; Li, D.; Peng, Y.; Wen, Z.
Zeitschriftenaufsatz
2019Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2018
 
Jahresbericht
2019Functional carbon nanotubes for MEMS applications: Miniaturized strain sensor and black coating for infrared devices
Böttger, S.; Bonitz, J.; Al-Falahi, F.; Schulz, S.E.; Hermann, S.
Konferenzbeitrag
2019Herstellung von neuartigen Reflektorsystemen und Erarbeitung einer systembezogenen Integrationstechnologie für VIS und IR Fabry-Pérot Interferometer (Dissertation)
Helke, C.
: Hiller, K.; Sinzinger, S.
Dissertation
2019Highly Miniaturized MEMS‐Based Test Platforms for Thermo‐Mechanical and Reliability Characterization of Nano‐Functional Elements - Technology and Functional Test Results
Meszmer, P.; Hahn, S.; Hiller, K.; Wunderle, B.
Zeitschriftenaufsatz
2019Identification of critical stress location on PCBs taking into account the influence of fixations and housing
Pantou, R.; Hildebrandt, M.; Dudek, R.; Rzepka, S.
Konferenzbeitrag
2019The Implementation of Semiconductor Based Biosensors Into Point of Need Systems for the Automatized Analysis of Complex Samples
Geidel, S.; Morschhauser, A.; Otto, T.
Konferenzbeitrag
2019An improved Green's function algorithm applied to quantum transport in carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2019Improved organic thin-film transistor performance by dielectric layer patterning
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Vollbrecht, J.; Kitzerow, H.; Paradies, J.; Hilleringmann, U.
Konferenzbeitrag
2019Inductive Locating Method to Locate Miniaturized Wireless Sensors within Inhomogeneous Dielectrics
Lange, S.; Schröder, D.; Hedayat, C.; Otto, T.; Hilleringmann, U.
Konferenzbeitrag
2019Induktionserwärmung für das Cu-Sn SLID-Waferbonden zum Packaging in der Mikrosystemtechnik
Hofmann, C.; Froehlich, A.; Kroll, M.; Wiemer, M.
Konferenzbeitrag
2019Inkjet Printing of Self‐Supporting and Self‐Contained Structured Objects Onto Liquid Surfaces
Goedel, W.A.; Gläser, K.; Mitra, D.; Thalheim, R.; Ueberfuhr, P.; Hammerschmidt, J.; Baumann, R.R.
Zeitschriftenaufsatz
2019Inorganic p-channel thin-film transistors using CuO nanoparticles
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2019Integration of plasmonic nanostructures for micro-opto-electromechanical-systems
Heldt, G.; Weiss, A.; Helke, C.; Erben, J.; Kurth, S.; Meinig, M.; Martin, J.; Hiller, K.; Reuter, D.; Otto, T.
Konferenzbeitrag
2019Intelligent workpiece carrier with inertial sensors for monitoring and optimizing manufacturing processesIntelligenter Werkstückträger mit Inertialsensorik zum Überwachen und Optimieren von Fertigungsprozessen
Forke, Roman; Forke, Erik; Alalus, Mohaned Khaled; Weidlich, Sebastian; Bülz, Daniel
Konferenzbeitrag
2019Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices
Otto, A.; Rzepka, S.; Wunderle, B.
Zeitschriftenaufsatz
2019Iron(III) β-diketonates: CVD precursors for iron oxide film formation
Pousaneh, E.; Korb, M.; Assim, K.; Rüffer, T.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2019Joining two worlds - hybrid integration of silicon based electronics and printed functionalities
Roscher, F.; Thalheim, R.; Seifert, T.; Paul, S.-D.; Zichner, R.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2019Low Power High Bandwidth Acceleration Sensor for Industrial Applications
Forke, R.; Hiller, K.; Hahn, S.; Weidlich, S.; Konietzka, S.; Motl, T.; Praedicow, A.; Otto, T.
Konferenzbeitrag
2019Magnetic tunnel junctions: Laser annealing versus oven annealing
Sharma, A.; Hoffmann, M.A.; Matthes, P.; Koehler, N.; Busse, S.; Mueller, M.; Exner, H.; Schulz, S.E.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2019Manufacturing of bio-compatible & degradable devices using inkjet technology for transient electronics
Mitra, K.Y.; Willert, A.; Sossalla, A.; Hoffmann, M.; Zichner, R.
Konferenzbeitrag
2019Measurements and Simulations of the Creep Strain in Flip Chip Solder Balls
Schindler-Saefkow, F.; Rost, F.; Rzepka, S.
Konferenzbeitrag
2019Measurements on the fly: Introducing mobile micro-sensors for biotechnological applications
Lauterbach, T.; Lüke, T.; Büker, M.-J.; Hedayat, C.; Gernandt, T.; Moll, R.; Grösel, M.; Lenk, S.; Seidel, F.; Brunner, D.; Bley, T.; Walther, T.; Lenk, F.
Zeitschriftenaufsatz
2019Mechanical deformation on nanoparticle-based thin-film transistors
Vidor, F.F.; Meyers, T.; Reker, J.; Mueller, K.; Wirth, G.I.; Hilleringmann, U.
Konferenzbeitrag
2019A MEMS IR optical chopper based on subwavelength structures
Kurth, S.; Meinig, M.; Wecker, J.; Seifert, M.; Hiller, K.; Otto, T.
Konferenzbeitrag
2019Micro Bending Test on Double Cantilever Beams: A specimen-centred approach to accurate determination of the visco-plastic properties of Sintered Silver for Power Electronics applications
Zschenderlein, U.; Klingler, M.; Arnold, J.; Baum, M.; Weißbach, M.; Schaal, M.; Wunderle, B.
Konferenzbeitrag
2019Micromachined phase-shifted array-type Mirau interferometer for swept-source OCT imaging
Gorecki, C.; Lullin, J.; Perrin, S.; Bargiel, S.; Albero, J.; Gaiffe, O.; Rutkovvski, J.; Cote, J.M.; Krauter, J.; Osten, W.; Wang, W.-S.; Weimer, M.; Froemel, J.
Zeitschriftenaufsatz
2019Microwave Radiation Detection with an Ultrathin Free-Standing Superconducting Niobium Nanohelix
Loesch, S.; Alfonsov, A.; Dobrovolskiy, O.V.; Keil, R.; Engemaier, V.; Baunack, S.; Li, G.; Schmidt, O.G.; Buerger, D.
Zeitschriftenaufsatz
2019Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Filter
Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Otto, T.
Konferenzbeitrag
2019Miniaturized multi sensor implant for monitoring of hemodynamic parameters
Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Schröder, Thomas; Wünsch, Dirk; Görtz, Michael; Seidl, Karsten
Konferenzbeitrag
2019Multisensor-Implantat zur Überwachung der Hämodynamik
Dogan, Özgü; Schierbaum, Nicolas; Weidenmüller, Jens; Baum, Mario; Görtz, Michael; Seidl, Karsten
Konferenzbeitrag
2019Nanoparticles and Organic Semiconductors for Flexible Electronics
Hilleringmann, U.; Reker, J.; Meyers, T.; Vidor, F.F.; Bezuidenhout, P.H.; Joubert, T.-H.
Konferenzbeitrag
2019Nanostructured al SWG Reflectors on thin LP-Si3N4 membranes as (TiO2/SiO2)³ Bragg reflector alternative for VIS Fabry-Pérot Interferometers
Helke, C.; Hiller, K.; Seiler, J.; Erben, J.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Otto, T.
Konferenzbeitrag
2019Next Generation of highly miniaturized Bulk-MEMS Fabry-Pérot Filters for infrared Microspectrometers
Ebermann, M.; Neumann, N.; Hoppe, S.; Hiller, K.; Seiler, J.; Helke, C.; Meinig, M.; Kurth, S.
Konferenzbeitrag
2019A Nonlinear Broadband Electromagnetic Vibration Energy Harvester Based on Double-Clamped Beam
Lu, Z.; Wen, Q.; He, X.; Wen, Z.
Zeitschriftenaufsatz
2019A Novel Indirect Quasi-Static Actuation Concept for 2D MEMS Micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Zeitschriftenaufsatz
2019A Novel Method for MEMS Wafer-Level Packaging. Selective and Rapid Induction Heating for Copper-Tin SLID Bonding
Hofmann, C.; Fröhlich, A.; Kimme, J.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2019Optical dipole nano-antennas on glass substrates
Haugwitz, T.; Erben, J.-W.; Neuman, N.; Reuter, D.; Plettemeier, D.
Konferenzbeitrag
2019Optimization of Platinum dioxide properties by plasma oxidation of sputtered PtOx
Basu, Nivedita; Sterin, N.S.; Saketh, Ram Mamidala; Shenoy, Apoorva; Bhat, Navakanta
Zeitschriftenaufsatz
2019Oxygen detection with zinc oxide nanoparticle structures
Schwabe, T.; Balke, A.; Bezuidenhout, P.H.; Reker, J.; Meyers, T.; Joubert, T.-H.; Hilleringmann, U.
Konferenzbeitrag
2019P-N Junction-Based Si Biochips with Ring Electrodes for Novel Biosensing Applications
Kiani, M.; Du, N.; Vogel, M.; Raff, J.; Hübner, U.; Skorupa, I.; Bürger, D.; Schulz, S.E.; Schmidt, O.G.; Schmidt, H.
Zeitschriftenaufsatz
2019Parameter dependency of DNA origami immobilization at micro- and nano structured CF polymer surfaces on SiO2
Hann, J.; Helke, C.; Lakatos, M.; Heerwig, A.; Nestler, J.; Erben, J.; Reuter, D.; Mertig, M.; Otto, T.
Zeitschriftenaufsatz
2019Parylene based technologies for smart coatings and wearables
Selbmann, F.; Roscher, F.
Zeitschriftenaufsatz
2019Paving the way for the replacement of solder interconnections in power electronics by silver-sinter using pulsed infrared thermography
Wargulski, D.R.; Rabay, B.; Stelzer, A.; Rudzki, J.; Hindel, A.; Bast, M.; Busse, D.; Auerswald, E.; Ras, M.A.
Konferenzbeitrag
2019Photosensitive Field‐Effect Transistors Made from Semiconducting Carbon Nanotubes and Non‐Covalently Attached Gold Nanoparticles
Blaudeck, T.; Preuß, A.; Scharf, S.; Notz, S.; Kossmann, A.; Hartmann, S.; Kasper, L.; Mendes, R.G.; Gemming, T.; Hermann, S.; Lang, H.; Schulz, S.E.
Zeitschriftenaufsatz
2019Piezoelectric scanning micromirror with built-in sensors based on thin film aluminum nitride
Meinel, K.; Stoeckel, C.; Melzer, M.; Zimmermann, S.; Forke, R.; Hiller, K.; Otto, T.
Konferenzbeitrag
2019Piezoelektrischer Mikrospiegel mit großem Scanwinkel, basierend auf Dünnschicht-Aluminiumnitrid
Meinel, K.; Stoeckel, C.; Melzer, M.; Zimmermann, S.; Forke, R.; Hiller, K.; Otto, T.
Konferenzbeitrag
2019Plattformkonzept zum Aufbau von hochintegrierten Multisensorknoten
Becker, Karl-Friedrich; Böttcher, Mathias; Schiffer, Michael; Pötter, Harald; Brockmann, Carsten; Freimund, Damian; Tschoban, Christian; Windrich, Frank; Braun, Tanja; Hopsch, Fabian; Heinig, Andy; Voigt, Sven; Baum, Mario; Hofmann, Lutz; Lang, Klaus-Dieter
Konferenzbeitrag
2019Printed functional applications: Batteries, communication elements, antennas and conductive paths on technical textiles
Meuser, C.; Willert, A.; Zichner, R.
Konferenzbeitrag
2019Printing Reinforcing Structures onto Microsieves that are Floating on a Water Surface
Goedel, W.A.; Gläser, K.; Mitra, D.; Hammerschmidt, J.; Thalheim, R.; Ueberfuhr, P.; Baumann, R.R.
Zeitschriftenaufsatz
2019Radially resolved electronic structure and charge carrier transport in silicon nanowires
Fuchs, F.; Gemming, S.; Schuster, J.
Zeitschriftenaufsatz
2019Regeneration of Assembled, Molecular-Motor-Based Bionanodevices
Rahman, M.A.; Reuther, C.; Lindberg, F.W.; Mengoni, M.; Salhotra, A.; Heldt, G.; Linke, H.; Diez, S.; Mansson, A.
Zeitschriftenaufsatz
2019Role of contacts in carbon nanotube giant piezoresistive sensors
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Heldt, G.; Reuter, D.; Schuster, J.; Hermann, S.
Konferenzbeitrag
2019Sealing of glass with titanium by glass pressing at the softening point
Winkler, Sebastian; Edelmann, Jan; Günther, Daniel; Wieland, Sebastian; Selbmann, Franz; Baum, Mario; Schubert, Andreas
Zeitschriftenaufsatz
2019Selective Induction Heating of Metallic Microstructures for Wafer-Level MEMS Packaging
Froehlich, A.; Hofmann, C.; Rochala, P.; Kimme, J.; Kroll, M.; Kraeusel, V.
Konferenzbeitrag
2019Self-aligned organic thin-film transistors for flexible electronics
Meyers, T.; Reker, J.; Temme, J.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2019Self-contained diagnostic platform for pathogen and antibiotic resistance detection for diabetic foot ulcers
Nestler, J.; Stiehl, C.; Graunitz, J.; Geidel, S.; Morschhauser, A.; Otto, T.; Schneemann, M.; Jnana, A.; Murali, T.S.; Satyamoorthy, K.; Maheswari, S.U.; Ramakrishnan, S.; Halder, P.; Dendukuri, D.; Bier, F.F.; Peter, H.
Konferenzbeitrag
2019Sensitivity control of carbon nanotube-based piezoresistive sensors by drain-induced barrier thinning
Böttger, S.; Wagner, C.; Lorkowski, F.; Hartmann, M.; Schuster, J.; Hermann, S.
Zeitschriftenaufsatz
2019Sensoric Micro and Nano Systems. Editorial
Zahn, D.R.T.; Schulz, S.E.; Hiller, K.; Wagner, C.; Reuter, D.; Otto, T.
Editorial
2019Simulation der Eigenerwärmung gedruckter Leiterbahnen für die thermische Auslegung
Bülz, D.; Streit, P.; Forke, R.; Otto, T.
Konferenzbeitrag
2019Simulation of Self-Heating of Printed Interconnects for Thermal Design
Bülz, D.; Streit, P.; Forke, R.; Otto, T.
Konferenzbeitrag
2019Spectroscopic ellipsometry and magneto-optical Kerr effect spectroscopy study of thermally treated Co60Fe20B20 thin films
Hoffmann, M.A.; Sharma, A.; Matthes, P.; Okano, S.; Hellwig, O.; Ecke, R.; Zahn, D.R.T.; Salvan, G.; Schulz, S.E.
Zeitschriftenaufsatz
2019Strain and screening: Optical properties of a small-diameter carbon nanotube from first principles
Wagner, C.; Schuster, J.; Schleife, A.
Zeitschriftenaufsatz
2019Surface effects and photoinduced relaxation processes in nanocomposites based on semiconductor quantum dots CdSe/ZnS and organic dye molecules
Zenkevich, E.I.; Stupak, A.P.; Kowerko, D.; Blaudeck, T.; Borczyskowski, C. von
Konferenzbeitrag
2019Synthesis of Mg and Zn diolates and their use in metal oxide deposition
Frenzel, P.; Preuß, A.; Bankwitz, J.; Georgi, C.; Ganss, F.; Mertens, L.; Schulz, S.E.; Hellwig, O.; Mehring, M.; Lang, H.
Zeitschriftenaufsatz
2019Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
Bargiel, S.; Baranski, M.; Wiemer, M.; Frömel, J.; Wang, W.-S.; Gorecki, C.
Zeitschriftenaufsatz
2019Technology variation measured with a stress chip for more reliable packages
Schindler-Saefkow, F.; Wich-Glasen, P.; Albrecht, J.; Rzepka, S.
Konferenzbeitrag
2019Thin film adhesion measurement by nanoindentation: Review of methodologies and validation by means of finite element simulations
Albrecht, J.; Weissbach, M.; Auersperg, J.; Dudek, R.; Kaulfersch, E.; Rzepka, S.
Konferenzbeitrag
2019Toward 3D-Printed Electronics: Inkjet-Printed Vertical Metal Wire Interconnects and Screen-Printed Batteries
Sowade, E.; Polomoshnov, M.; Willert, A.; Baumann, R.R.
Zeitschriftenaufsatz
2019Transport Properties in Co-doped ZnO/YMnO3 n-p Heterojunctions
Torres, M.L.; Skorupa, I.; Schmidt, H.; Schmidt, O.G.; Gomez, M.E.
Zeitschriftenaufsatz
2019VIS Fabry-Pérot Interferometer with structured (TiO2/PE-SiO2)3 Bragg-reflectors on 5mm large LP-Si3N4 membranes
Helke, C.; Hiller, K.; Seiler, J.; Werner, T.; Meinig, M.; Kurth, S.; Otto, T.
Konferenzbeitrag
2019Wafer- und Chipintegration mittels reaktiver CuO/Al Multilagensysteme
Vogel, K.; Hertel, S.; Bender, H.; Roscher, F.; Zimmermann, S.; Wiemer, M.
Konferenzbeitrag
2018"3rd Level" Solder Joint Reliability Investigations for Transfer of Consumer Electronics in Automotive Use
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Döring, R.; Seiler, B.; Fries, T.; Zhang, M.; Ortmann, R.W.
Konferenzbeitrag
20183D-Packaging-Technologien zur Herstellung intelligenter medizinischer Implantate
Wuensch, D.; Schroeder, T.; Baum, M.; Hiller, K.; Forke, R.; Wiemer, M.; Weidenmueller, J.; Dogan, O.; Goertz, M.
Konferenzbeitrag
2018Active flow control in wind turbines - integration technologies and assessment of economic effects
Schüller, Martin; Lipowski, Mathias; Weigel, Perez; Symmank, Christina; Meynerts, Lilly; Walther, Marco; Dziuba, Franz; Otto, Thomas; Götze, Uwe; Kroll, Lothar
Konferenzbeitrag
2018AlN film based piezoelectric large-aperture MEMS scanning micromirror integrated with angle sensors
Lei, H.; Wen, Q.; Yu, F.; Li, D.; Shang, Z.; Huang, J.; Wen, Z.
Zeitschriftenaufsatz
2018Aluminum Patterned Electroplating from AlCl3-[EMIm]Cl Ionic Liquid Towards Microsystems Application
Al Farisi, M.S.; Hertel, S.; Wiemer, M.; Otto, T.
Zeitschriftenaufsatz
2018Application of quantum cascade laser absorption spectroscopy for correlation studies in plasma etching processes in the semiconductor industry
Lang, N.; Zimmermann, S.; Zimmermann, H.; Macherius, U.; Uhlig, B.; Schaller, M.; Schulz, S.E.; Röpcke, J.; Helden, J.H. van
Konferenzbeitrag
2018Application-driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R.
Zeitschriftenaufsatz
2018Approach to combine electron-beam lithography and two-photon polymerization for enhanced nano-channels in network-based biocomputation devices
Heldt, Georg; Meinecke, Christoph; Steenhusen, Sönke; Korten, Till; Groß, Matteo; Domann, Gerhard; Lindberg, F.; Reuter, Danny; Diez, S.; Linke, H.; Schulz, Stefan E.
Konferenzbeitrag
2018Automated virtual prototyping for fastest time-to-market of new system in package solutions
Gadhiya, Ghanshyam; Brämer, Birgit; Rzepka, Sven
Konferenzbeitrag
2018β-Ketoiminato-based copper(II) complexes as CVD precursors for copper and copper oxide layer formation
Pousaneh, E.; Korb, M.; Dzhagan, V.; Weber, M.; Noll, J.; Mehring, M.; Zahn, D.R.T.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Bidirectional data transmission for battery-less medical implants
Dogan, Özgü; Hennig, Andreas; Stanitzki, Alexander; Baum, Mario; Grabmaier, Anton
Zeitschriftenaufsatz
2018Challenges in transferring quantum dot sensitized solar cells on technical textiles
Heinrich, K.; Martin, J.; Mehlhorn, H.; Langenickel, J.; Selbmann, F.; Hartwig, M.; Otto, T.
Konferenzbeitrag
2018Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue
Dudek, R.; Hildebrandt, M.; Rzepka, S.; Fries, T.; Döring, R.; Seiler, B.; Ortmann, R.W.
Zeitschriftenaufsatz
2018Deposition methods for C8-BTBT in flexible TFTs
Meyers, T.; Reker, J.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2018Deposition speed optimization for ZnO nanoparticle TFTs using doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2018Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development
Correia, V.; Mitra, K.Y.; Castro, H.; Rocha, J.G.; Sowade, E.; Baumann, R.R.; Lanceros-Méndez, S.
Zeitschriftenaufsatz
2018Design methodology and results evaluation of a heating functionality in modular lab-on-chip systems
Streit, P.; Nestler, J.; Shaporin, A.; Graunitz, J.; Otto, T.
Zeitschriftenaufsatz
2018Design of robust packages by deliberate release of elastic energy to avoid interfacial crack propagation
Pufall, R.; Goroll, M.; Reuther, G.M.; Pflügler, N.; Udiljak, D.; Dudek, R.
Konferenzbeitrag
2018Effizienter Modellierungsansatz für die transiente, gekoppelte elektro-thermische Simulation am Beispiel einer D²PAK-Anwendung
Schacht, R.; Rzepka, S.
Konferenzbeitrag
2018Einfluss von Defekten auf die Gitterschwingungen von Kohlenstoffnanoröhren
Noerdemann, A.
Bachelor Thesis
2018Electrical Conductivity Modeling of Graphene-based Conductor Materials
Rizzi, L.; Zienert, A.; Schuster, J.; Köhne, M.; Schulz, S.E.
Zeitschriftenaufsatz
2018Electroanalysis moves towards paper-based printed electronics
Cinti, S.; Colozza, N.; Cacciotti, I.; Moscone, D.; Polomoshnov, M.; Sowade, E.; Baumann, R.R.; Arduini, F.
Zeitschriftenaufsatz
2018Electrochemical deposition of reactive material systems for assembly and packaging applications
Hertel, Silvia; Schulte, Wiebke; Weiser, Mathias; Becker, Mike; Wiemer, Maik; Otto, Thomas
Konferenzbeitrag
2018Electroforming-free resistive switching in polycrystalline YMnO3 thin films
Rayapati, V.R.; Du, N.; Bürger, D.; Patra, R.; Skorupa, I.; Matthes, P.; Stöcker, H.; Schulz, S.E.; Schmidt, H.
Zeitschriftenaufsatz
2018Electronic transport through defective semiconducting carbon nanotubes
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2018Elektrochemische Abscheidung für die Leiterplatte
Hertel, S.; Wuensch, D.; Wiemer, M.; Otto, T.; Friedrich, S.
Konferenzbeitrag
2018Elektronentransport in Graphen-Nanobändern mit Kantenrauheit
Rodemund, T.S.
Bachelor Thesis
2018Entwicklung eines Prozesses für das Entfernen von SiO2-Monolagen mittels Fluorkohlenstoff
Dittmar, N.; Kuechler, M.; Meinecke, C.; Reuter, D.; Otto, T.
Konferenzbeitrag
2018Entwicklung von Schwingungssensoren auf MEMS-Basis für Condition Monitoring Systeme im Maschinen- und Anlagenbau
Dittrich, C.; Forke, R.; Hiller, K.; Kreutziger, P.; Kuerschner, R.; Meinecke, C.; Reuter, D.; Weidlich, S.; Streit, P.; Hahn, S.
Konferenzbeitrag
2018Evaluation of Ag-sinter and CuSn-TLP based joining technologies on lead frame
Otto, A.; Schroeder, T.; Dudek, R.; Wang, W.-S.; Baum, M.; Wiemer, M.; Doering, R.; Kurian, J.J.; Murayama, K.; Oi, K.; Koyama, T.; Rzepka, S.
Konferenzbeitrag
2018Fabrication and operation of protein-powered biocomputation using nanostructured networks
Meinecke, C.; Reuter, D.; Schulz, S.E.; Korten, T.; Heldt, G.; Diez, S.
Konferenzbeitrag
2018Fabrication of organic photo detectors using inkjet technology and its comparison to conventional deposition processes
Cherian, D.; Mitra, K.Y.; Hartwig, M.; Malinowski, P.E.; Baumann, R.R.
Zeitschriftenaufsatz
2018Fatigue Crack Growth Analysis of Interface between Lead Frame and Molding Compound
Bektas, E.; Broermann, K.; Brumm, S.P.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B.
Konferenzbeitrag
2018Feasible device architectures for ultrascaled CNTFETs
Pacheco-Sanchez, A.; Fuchs, F.; Mothes, S.; Zienert, A.; Schuster, J.; Gemming, S.; Claus, M.
Zeitschriftenaufsatz
2018Field-Driven Hopping Transport of Oxygen Vacancies in Memristive Oxide Switches with Interface-Mediated Resistive Switching
Du, N.; Manjunath, N.; Li, Y.; Menzel, S.; Linn, E.; Waser, R.; You, T.; Bürger, D.; Skorupa, I.; Walczyk, D.; Walczyk, C.; Schmidt, O.G.; Schmidt, H.
Zeitschriftenaufsatz
2018FR4-Based Electromagnetic Scanning Micromirror Integrated with Angle Sensor
Lei, H.; Wen, Q.; Yu, F.; Zhou, Y.; Wen, Z.
Zeitschriftenaufsatz
2018Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2017
 
Jahresbericht
2018Functional integration - structure-integrated wireless sensor technology targeting smart mechanical engineering applications
Rülke, Steffen; Beyer, Volkhard; Zorn, Wolfgang; Meinig, Marco; Wecker, Julia; Reuter, Danny; Deicke, Frank; Clausner, André; Werner, Thomas
Konferenzbeitrag
2018Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology
Geneiß, V.; Lüke, T.; Hedayat, C.; Wolf, M.; Janek, F.; Meißner, T.; Barth, M.; Eberhardt, W.; Zimmermann, A.; Otto, T.
Konferenzbeitrag
2018Implantable multi-sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Zeitschriftenaufsatz
2018An Improved Design for 2D Arrays of Capacitive Micromachined Ultrasound Transducers: Modeling, Fabrication, and Characterization
Baum, M.; Saeidi, N.; Vogel, K.; Schroeder, T.; Selvam, K.G.M.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Indirect X-ray detectors based on inkjet-printed photodetectors with a screen-printed scintillator layer
Oliveira, J.; Correia, V.; Sowade, E.; Etxebarria, I.; Rodriguez, R.D.; Mitra, K.Y.; Baumann, R.R.; Lanceros-Méndez, S.
Zeitschriftenaufsatz
2018Influence of defect-induced deformations on electron transport in carbon nanotubes
Teichert, F.; Wagner, C.; Croy, A.; Schuster, J.
Zeitschriftenaufsatz
2018Influence of the electrode material on the performance of BTBT-based thin-film transistors
Meyers, T.; Reker, J.; Petrov, D.; Hilleringmann, U.; Vidor, F.F.
Konferenzbeitrag
2018Inkjet printing and intense pulsed light sintering of multiwall carbon nanotubes for sensor applications
Mitra, D.; Zubkova, T.; Gerlach, C.; Kanoun, O.; Miesel, D.; Lang, H.; Baumann, R.R.
Konferenzbeitrag
2018Inkjet Printing and Intense Pulsed Light Sintering of Multiwall Carbon Nanotubes for Sensor Applications
Mitra, D.; Zubkova, T.; Gerlach, C.; Kanoun, O.; Miesel, D.; Lang, H.; Baumann, R.R.
Zeitschriftenaufsatz
2018Inkjet printing of patterned nanocarbon absorber layers for pyroelectric infrared detectors
Zeiner, C.; Polomoshnov, M.; Müller, M.; Sowade, E.; Günther, A.; Neumann, N.; Seifert, T.; Blaudeck, T.; Hermann, S.; Baumann, R.R.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Inkjet-Printed Wireless Chemiresistive Sensors: A review
Hartwig, M.; Zichner, R.; Joseph, Y.
Zeitschriftenaufsatz
2018Integrated Microsystems for Smart Applications
Otto, T.; Kurth, S.; Voigt, S.; Morschhauser, A.; Meinig, M.; Hiller, K.; Martin, J.; Vogel, M.
Zeitschriftenaufsatz
2018Integration of covalent and non-covalent functionalized SWCNTs in FETs
Kossmann, A.; Adner, D.; Blaudeck, T.; Hermann, S.; Schulz, S.E.; Lang, H.
Konferenzbeitrag
2018Investigation of active power cycling combined with passive thermal cycles on discrete power electronic devices for automotive applications
Otto, A.; Rzepka, S.; Wunderle, B.
Konferenzbeitrag
2018Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application
Farisi, M.S.A.; Hertel, S.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2018Investigation of Electromagnetic Angle Sensor Integrated in FR4-Based Scanning Micromirror
Wen, Q.; Lei, H.; Yu, F.; Li, D.; She, Y.; Huang, J.; Huang, L.; Wen, Z.
Zeitschriftenaufsatz
2018Investigation on the influence of injection molding parameters on high frequency permittivity up to 3 GHz on MID thermoplastics and reliability of permittivity during environmental testing
Wolf, M.; Janek, F.; Meissner, T.; Wigger, B.; Barth, M.; Guenter, T.; Eberhardt, W.; Zimmermann, A.; Geneiss, V.; Lueke, T.; Hedayat, C.; Otto, T.
Konferenzbeitrag
2018Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Zeitschriftenaufsatz
2018Klebeelement und Ventilanordnung
Morschhauser, Andreas; Nestler, Jörg; Otto, Thomas; Stiehl, Cornelia
Patent
2018Leitprojekt "Go Beyond 4.0". Individualisierte Massenfertigung
Otto, T.
Aufsatz in Buch
2018Liquid crystalline dithienothiophene derivatives for organic electronics
Vollbrecht, J.; Oechsle, P.; Stepen, A.; Hoffmann, F.; Paradies, J.; Meyers, T.; Hilleringmann, U.; Schmidtke, J.; Kitzerow, H.
Zeitschriftenaufsatz
2018Long-term thermal fatigue testing of solder joints and related fatigue life predictions
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Grübl, W.; Schuck, B.
Konferenzbeitrag
2018Lotermüdung von SAC- und Innolot-Verbindungen unter Langzeit-Feldbeanspruchungen und vergleichende Simulationen
Dudek, R.; Hildebrandt, M.; Kreyßig, K.; Rzepka, S.; Novak, M.; Beart, K.; Grübl, W.; Schuch, B.
Konferenzbeitrag
2018Magnesium β-ketoiminates as CVD precursors for MgO formation
Pousaneh, E.; Rüffer, T.; Assim, K.; Dzhagan, V.; Noll, J.; Zahn, D.R.T.; Mertens, L.; Mehring, M.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Magneto-optical spectroscopy and spectroscopic ellipsometry of Co60Fe20B20 thin films
Sharma, A.; Almeida, M.; Matthes, P.; Ecke, R.; Zahn, D.R.T.; Schulz, S.E.; Salvan, G.
Konferenzbeitrag
2018Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulation
Albrecht, J.; Weissbach, M.; Auersperg, J.; Rzepka, S.
Konferenzbeitrag
2018A micro-electromechanical systems based vibration energy harvester with aluminum nitride piezoelectric thin film deposited by pulsed direct-current magnetron sputtering
He, X.; Wen, Q.; Lu, Z.; Shang, Z.; Wen, Z.
Zeitschriftenaufsatz
2018Mikro- und Nanotechnologien zur Herstellung steuerbarer optischer Komponenten
Hiller, K.; Helke, C.; Seifert, M.; Seiler, J.; Kurth, S.; Meinig, M.; Wecker, J.
Konferenzbeitrag
2018Miniaturized NIR Spectrometer Based on Novel MOEMS Scanning Tilted Grating
Huang, J.; Wen, Q.; Nie, Q.; Chang, F.; Zhou, Y.; Wen, Z.
Zeitschriftenaufsatz
2018Multiscale residual stress analysis in thin film layers
Weißbach, M.; Auerswald, E.; Hildebrandt, M.; Rzepka, S.
Konferenzbeitrag
2018Multiscale simulation of metallic copper and copper oxide atomic layer deposition from Cu Beta-diketonates
Hu, X.
Dissertation
2018Nanostructures for smart systems
Martin, J.; Saupe, R.; Langenickel, J.; Moebius, M.; Heinrich, K.; Weiß, A.; Otto, T.
Konferenzbeitrag
2018A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation
Wunderle, B.; May, D.; Heilmann, J.; Arnold, J.; Hirscheider, J.; Li, Y.; Bauer, J.; Ras, M.A.
Konferenzbeitrag
2018On the Experimental Characterization of Morphing Structures
Dimino, I.; Amendola, G.; Pecora, R.; Concilio, A.; Gratias, A.; Schueller, M.
Aufsatz in Buch
2018On the thermo-mechanical risk assessment of complex Printed Circuit Boards (PCB) by finite element modelling and warpage measurements
Albrecht, J.; Braemer, B.; Hildebrandt, M.; Taubert, P.
Konferenzbeitrag
2018On the TSV delamination risk dependence on TSV distance and silicon crystal orientation
Auersperg, J.; Albrecht, J.; Rzepka, S.
Konferenzbeitrag
2018Parylene as a Dielectric Material for Electronic Applications in Space
Selbmann, F.; Baum, M.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2018Performance analysis of CuO nanoparticle-based thin-film transistors
Reker, J.; Meyers, T.; Petrov, D.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2018Plasmonic dipole nanoantennas on a SiO2/Si substrate and their characterization undefined
Haugwitz, T.; Erben, J.; Neumann, N.; Reuter, D.; Plettemeier, D.
Konferenzbeitrag
2018Polymer-based doping control for performance enhancement of wet-processed short-channel CNTFETs
Hartmann, M.; Schubel, R.; Claus, M.; Jordan, R.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz
2018Portable Sensor System for UV-Irradiation Measurements
Petrov, D.; Narayan, R.S.; Hilleringmann, U.
Konferenzbeitrag
2018Printed batteries and conductive patterns in technical textiles
Willert, A.; Meuser, C.; Baumann, R.R.
Zeitschriftenaufsatz
2018Printing techniques for batteries
Willert, A.; Tran-Le, A.-T.; Mitra, K.Y.; Clair, M.; Costa, C.M.; Lanceros-Méndez, S.; Baumann, R.R.
Aufsatz in Buch
2018Process development of large area R2R printing and sintering of conductive patterns by inkjet and infra-red technologies tailored for printed electronics
Mitra, K.Y.; Kapadia, S.; Hartwig, M.; Sowade, E.; Xu, Z.; Baumann, R.R.; Zichner, R.
Zeitschriftenaufsatz
2018Quantum transport in defective carbon nanotubes at mesoscopic length scales
Teichert, F.
Dissertation
2018Reactive bonding with oxide based reactive multilayers
Vogel, K.; Roscher, F.; Wiemer, M.; Zimmermann, S.; Otto, T.
Konferenzbeitrag
2018Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U.
Zeitschriftenaufsatz
2018Reliability assessment and failure mode analysis of MEMS accelerometers for space applications
Marozau, I.; Auchlin, M.; Pejchal, V.; Souchon, F.; Vogel, D.; Lahti, M.; Saillen, N.; Sereda, O.
Zeitschriftenaufsatz
2018Reliability testing of integrated low-temperature PVD PZT films
Monteiro Diniz Reis, D.; Rzepka, S.; Hiller, K.
Zeitschriftenaufsatz
2018RFID units for a product based control of industrial production systems
Schmidt, M.; Metz, G.; Hedayat, C.; Otto, T.; Petrov, D.
Konferenzbeitrag
2018The role of plasma analytics in leading-edge semiconductor technologies
Zimmermann, S.; Haase, M.; Lang, N.; Röpcke, J.; Schulz, S.E.; Otto, T.
Zeitschriftenaufsatz
2018SAMPL - Secure Additive Manufacturing Platform
Gratias, A.; Böttcher, F.; Holland, M.; Schueller, M.
Konferenzbeitrag
2018Scaling up integration of carbon nanotubes into Micro-Electro-Mechanical systems
Böttger, S.; Jöhrmann, N.; Bonitz, J.; Wunderle, B.; Schulz, S.E.; Hermann, S.
Konferenzbeitrag
2018Special issue on 4th International Conference on Smart Systems Engineering (SmaSys 2016)
Khosla, A.; Furukawa, H.; Michel, B.
Zeitschriftenaufsatz
2018Special Issue: International Conference on Applied System Innovation (ICASI 2016)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B.
Zeitschriftenaufsatz
2018Special Issue: International Conference on Applied System Innovation (ICASI 2017)
Young, S.-J.; Meen, T.-H.; Khosla, A.; Michel, B.
Zeitschriftenaufsatz
2018Stochastic analyzes and Monte-Carlo simulations of nonlinear and non-ideal mixed-signal phase-locked loops
Schmidt, M.; Hangmann, C.; Hedayat, C.; Hilleringmann, U.; Otto, T.
Konferenzbeitrag
2018Stochastische Untersuchung von Oberflächeninteraktionen hochenergetischer Teilchen
Rothe, T.
: Gemming, S.; Schuster, J.; Lorenz, E.
Bachelor Thesis
2018Stress analyses in HPC-soldered assemblies by optical measurement and FEA
Dudek, R.; Döring, R.; Rzepka, S.; Herberholz, T.; Feil, D.; Seiler, B.; Scheiter, L.; Schellenberg, C.; Fritzsche, S.
Konferenzbeitrag
2018Strukturierungsverfahren
Fader, Robert; Lorenz, Jürgen; Rommel, Mathias; Baum, Mario; Danylyuk, Serhiy; Gillner, Arnold; Stollenwerk, Jochen; Bläsi, Benedikt
Aufsatz in Buch
2018Technologie zur Herstellung von nanostrukturierten Netzwerken für biomolekularbetriebene Computer
Meinecke, C.; Korten, T.; Heldt, G.; Reuter, D.; Diez, S.; Schulz, S.E.
Konferenzbeitrag
2018Tetranuclear yttrium and gadolinium 2-acetylcyclopentanoate clusters: Synthesis and their use as spin-coating precursors for metal oxide film formation for field-effect transistor fabrication
Pousaneh, E.; Preuß, A.; Assim, K.; Rüffer, T.; Korb, M.; Tittmann-Otto, J.; Hermann, S.; Schulz, S.E.; Lang, H.
Zeitschriftenaufsatz
2018Thermo-mechanical characterisation of thin sputtered copper films on silicon: Towards elasto-plastic, fatigue and subcritical fracture-mechanical data
Wunderle, B.; May, D.; Zschenderlein, U.; Ecke, R.; Springborn, M.; Jöhrmann, N.; Pareek, K.A.; Heilmann, J.; Stiebing, M.; Arnold, J.; Dudek, R.; Schulz, S.; Wolf, M.J.; Rzepka, S.
Konferenzbeitrag
2018Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints
Kumar, A.; Zschenderlein, U.; Baum, M.; Brunschwiler, T.; Wright, D.N.; Wunderle, B.
Konferenzbeitrag
2018Thin Film Piezoelectric Aluminum Nitride for Piezoelectric Micromachined Ultrasonic Transducers
Stoeckel, C.; Meinel, K.; Melzer, M.; Otto, T.
Konferenzbeitrag
2018Time Domain Electrical Characterization in Zinc Oxide Nanoparticle Thin-Film Transistors
Becker, T.E.; Vidor, F.F.; Wirth, G.I.; Meyers, T.; Reker, J.; Hilleringmann, U.
Konferenzbeitrag
2018Transient electro-thermal coupled system simulation
Schacht, R.; Rzepka, S.
Konferenzbeitrag
2018Transient thermal storage of excess heat using eutectic BiSn as phase change material for the thermal management of an electronic power module
Wunderle, B.; Springborn, M.; May, D.; Heilmann, J.; Manier, C.-A.; Abo Ras, M.; Oppermann, H.; Sarkany, Z.; Mitova, R.
Konferenzbeitrag
2018Tuning of diameter and electronic type of CCVD grown SWCNTs
Jafarpour, S.M.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz
2018Vertically aligned carbon nanotube films as absorption layers for IR applications
Kini, Mandar; Bonitz, Jens; Müller, Michael; Schulz, Stefan E.; Hermann, Sascha
Konferenzbeitrag
2018Warpage measurement on bonded wafers under thermal load
Tröger, B.; Wünsch, D.; Hildebrandt, M.; Taubert, P.; Gottfried, K.; Fries, T.
Konferenzbeitrag
2018Welcome to the 12th Smart Systems Integration
Otto, T.
Konferenzbeitrag
2018Work function and conductivity of inkjet-printed silver layers: Effect of inks and post-treatments
Mitra, D.; Mitra, K.Y.; Dzhagan, V.; Pillai, N.; Zahn, R.T.; Baumann, R.R.
Zeitschriftenaufsatz
20173D packaging for an implantable hemodynamic control system
Schroeder, T.; Baum, M.; Wuensch, D.; Wiemer, M.; Otto, T.
Zeitschriftenaufsatz
20173D packaging technologies for smart medical implants
Schröder, Tim; Wünsch, Dirk; Baum, Mario; Hiller, Karla; Wiemer, Maik; Otto, Thomas; Weidenmüller, Jens; Dogan, Özgü; Utz, Alexander; Görtz, Michael
Konferenzbeitrag
20173D wafer level packaging by using Cu-through silicon vias for thin MEMS accelerometer packages
Hofmann, L.; Schubert, I.; Wuensch, D.; Ecke, R.; Vogel, K.; Gottfried, K.; Reuter, D.; Rennau, M.; Schulz, S.E.; Gessner, T.
Zeitschriftenaufsatz
20173D-wafer level packaging approaches for MEMS by using cu-based high aspect ratio through silicon vias
Hofmann, L.
Dissertation
2017Ab initio study of the trimethylaluminum atomic layer deposition process on carbon nanotubes
Förster, A.; Wagner, C.; Schuster, J.; Friedrich, J.
Zeitschriftenaufsatz
2017Application driven reliability research of next generation for automotive electronics: Challenges and approaches
Rzepka, S.; Otto, A.; Vogel, D.; Dudek, R.
Konferenzbeitrag
2017Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors
Dempwolf, Sophia; Hofmann, L.; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, S.E.; Gerbach, Ronny
Konferenzbeitrag
2017Ätzung von Nanostrukturen
Hilleringmann, U.
Aufsatz in Buch
2017Biomedical diagnostics enabled by integrated organic and printed electronics
Ahmadraji, T.; Gonzalez-Macia, L.; Ritvonen, T.; Willert, A.; Ylimaula, S.; Donaghy, D.; Tuurala, S.; Suhonen, M.; Smart, D.; Morrin, A.; Efremov, V.; Baumann, R.R.; Raja, M.; Kemppainen, M.; Killard, A.J.
Zeitschriftenaufsatz
2017Board level reliability assessment of consumer components for automotive use by simulation and sophisticated optical deformation analyses
Dudek, R.; Hildebrand, M.; Rzepka, S.; Beintner, J.; Döring, R.; Scheiter, L.; Seiler, B.; Fries, T.; Ortmann, R.W.
Konferenzbeitrag
2017Challenges of nanostructure-integration in Fabry-Pérot interferometers as alternative to Bragg reflectors: An example for Match 1:1-, eBeam-, and nanoimprint lithography
Helke, C.; Hiller, K.; Erben, J.W.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Konferenzbeitrag
2017Challenges of the intense pulsed light sintering of inkjet-printed conducting patterns on flexible substrates
Mitra, D.; Baumann, R.R.
Konferenzbeitrag
2017Characterization of epoxy based highly filled die attach materials in microelectronics
Maus, I.; Liebl, C.; Fink, M.; Vu, D.-K.; Hartung, M.; Preu, H.; Jansen, K.M.B.; Michel, B.; Wunderle, B.; Weiss, L.
Konferenzbeitrag
2017Characterization of partial discharge performance of die attach adhesives
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Zeitschriftenaufsatz
2017Complementary field-effect transistors for flexible electronics
Hilleringmann, U.; Vidor, F.F.; Meyers, T.
Konferenzbeitrag
2017A concept for an ice detection system on overhead power lines, theory and practical results
Vagapov, G.; Fedotov, A.; Kurth, S.; Voigt, S.
Konferenzbeitrag
2017Conductivity and microstructure of inkjet printed nanoparticle silver layers processed with intense pulsed light (IPL) sintering on various polymeric substrates
Mitra, D.; Baumann, R.R.
Konferenzbeitrag
2017Control system design for a morphing wing trailing edge
Dimino, I.; Ciminello, M.; Concilio, A.; Gratias, A.; Schueller, M.; Pecora, R.
Konferenzbeitrag
2017Controlling the crack formation in inkjet-printed silver nanoparticle thin-films for high resolution patterning using intense pulsed light treatment
Gokhale, P.; Mitra, D.; Sowade, E.; Mitra, K.Y.; Gomes, H.L.; Ramon, E.; Al-Hamry,A.; Kanoun, O.; Baumann, R.R.
Zeitschriftenaufsatz
2017Correlation between mechanical material properties and stress in 3D-integrated silicon microstructures
Stiebing, M.; Vogel, D.; Steller, W.; Wolf, M.J.; Zschenderlein, U.; Wunderle, B.
Konferenzbeitrag
2017Deposition of ZnO nanoparticles for thin-film transistors by doctor blade process
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2017Design of a 2D MEMS micromirror with indirect static actuation
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Konferenzbeitrag
2017Detection of mechanical loads in lightweight structures using quantum dots photoluminescence
Moebius, M.; Martin, J.; Hartwig, M.; Baumann, R.R.; Otto, T.
Konferenzbeitrag
2017Development history and current achievements of printed primary batteries
Willert, A.; Baumann, R.R.
Konferenzbeitrag
2017Development of CMOS-compatible materials for thermoelectric and sensor applications in semiconductor industry
Wagner-Reetz, M.; Calvo, J.; Nichenametla, C.K.; Kühnel, K.; Göhler, T.; Schulz, S.; Burkov, A.; Uhlig, B.
Vortrag
2017Development of sensor integration concept for mass production processes
Rost, F.; Arnold, B.; Decker, R.; Bauer, A.; Tsapkolenko, A.; Rzepka, S.; Mehner, J.; Kroll, L.
Konferenzbeitrag
2017Editorial: Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014), held in Kenting, Taiwan Oct. 31-Nov 2, 2014
Hsieh, W.H.; Michel, B.
Editorial
2017Effective viscoelastic plastic material modeling for faster and reliable calculations
Schindler-Saefkow, F.; Pantou, R.; Keller, J.; Rzepka, S.
Konferenzbeitrag
2017Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes
Jafarpour, S.M.; Kini, M.; Schulz, S.E.; Hermann, S.
Zeitschriftenaufsatz
2017Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor
Auersperg, J.; Auerswald, E.; Collet, C.; Dean, T.; Vogel, D.; Winkler, T.; Rzepka, S.
Konferenzbeitrag
2017Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application
Schacht, R.; Rzepka, S.
Konferenzbeitrag
2017Elastic and piezoresistive properties of nickel carbides from first principles
Kelling, J.; Zahn, P.; Schuster, J.; Gemming, S.
Zeitschriftenaufsatz
2017An electromagnetic scanning mirror integrated with blazed grating and angle sensor for a near infrared micro spectrometer
Zhou, Y.; Wen, Q.; Wen, Z.Y.; Huang, J.; Chang, F.
Zeitschriftenaufsatz
2017Electronic transport in metallic carbon nanotubes with mixed defects within the strong localization regime
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2017Elektrochemische Abscheidung von Aluminium und Palladium aus ionischen Flüssigkeiten für das reaktive Waferbonden
Hertel, S.; Schröder, T.J.; Wünsch, D.; Wiemer, M.; Geßner, T.
Zeitschriftenaufsatz
2017Emerging applications: PICs as a platform for lab on chip devices
Geidel, S.; Otto, T.
Zeitschriftenaufsatz
2017Erweiterung konventioneller Bauelemente durch Nanotechniken
Hilleringmann, U.; Horstmann, J.T.
Aufsatz in Buch
2017Fabrication and operation of kinesin-1-powered biocomputation networks
Meinecke, C.; Korten, Till; Heldt, G.; Reuter, D.; Diez, Stefan
Konferenzbeitrag
2017Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating
Chen, J.-J.; Lin, G.-Q.; Wang, Y.; Sowade, E.; Baumann, R.R.; Feng, Z.-S.
Zeitschriftenaufsatz
2017FE analyses and power cycling tests on the thermo-mechanical performance of silver sintered power semiconductors with different interconnection technologies
Dudek, R.; Doering, R.; Otto, A.; Rzepka, S.; Stegmeier, S.; Kiefl, S.; Lunding, A.; Eisele, R.
Konferenzbeitrag
2017Filling of high aspect ratio (HAR) nanometer-scale silicon trenches by electrochemical deposition of nickel
Hofmann, C.; Kurth, F.; Wiemer, M.; Otto, T.; Hiller, K.
Konferenzbeitrag
2017Fluidic actuators for separation control at the engine/wing junction
Schloesser, P.; Meyer, M.; Schueller, M.; Weigel, P.; Bauer, M.
Zeitschriftenaufsatz
2017Fraunhofer-Institut für Elektronische Nanosysteme. Jahresbericht 2016
 
Jahresbericht
2017Fully inkjet-printed thin-film transistor array manufactured on paper substrate for cheap electronic applications
Mitra, K.Y.; Polomoshnov, M.; Martinez-Domingo, C.; Mitra, D.; Ramon, E.; Baumann, R.R.
Zeitschriftenaufsatz
2017Go beyond 4.0 - towards digital fabrication based on printing
Willert, A.; Zichner, R.; Thalheim, R.; Baumann, R.R.; Otto, T.
Konferenzbeitrag
2017Halbleitende Nanopartikel für Feldeffekttransistoren
Hilleringmann, U.
Aufsatz in Buch
2017HED-TIE: A wafer-scale approach for fabricating hybrid electronic devices with trench isolated electrodes
Banerjee, S.; Bülz, D.; Solonenko, D.; Reuter, D.; Deibel, C.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2017High-Q whispering gallery microdisk resonators based on silicon oxynitride
Hett, T.; Kraemmer, S.; Hilleringmann, U.; Kalt, H.; Zrenner, A.
Zeitschriftenaufsatz
2017Hocheffiziente Modellierung, Charakterisierung und Analyse von Mixed-Signal Phasenregelkreisen unter Berücksichtigung von nichtlinearen und nicht-idealen Effekten
Hangmann, C.
Dissertation
2017Implantable hemodynamic controlling system with a highly miniaturized two axis acceleration sensor
Baum, Mario; Wünsch, Dirk; Hiller, Karla; Forke, Roman; Schröder, Tim; Weidlich, Sebastian; Hahn, Susann; Reuter, Danny; Wiemer, Maik; Weidenmüller, Jens; Dogan, Özgü; Görtz, Michael; Otto, Thomas
Konferenzbeitrag
2017Implantable multi sensor system for hemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Schröder, Tim; Wünsch, Dirk; Görtz, Michael; Grabmaier, Anton
Konferenzbeitrag
2017Improved recursive Green's function formalism for quasi one-dimensional systems with realistic defects
Teichert, F.; Zienert, A.; Schuster, J.; Schreiber, M.
Zeitschriftenaufsatz
2017Increase of functional density of hybrid structures by integration of micro and nano systems
Schueller, M.; Otto, T.; Mehner, J.; Troeltzsch, J.; Kroll, L.
Konferenzbeitrag
2017Inductive temperature measurement for fast and optimized adhesive curing
Schröder, D.; Büker, M.-J.; Hedayat, C.; Kleemeier, M.; Lühring, A.
Konferenzbeitrag
2017Influence of processing atmosphere for QD-LEDs
Langenickel, J.; Weiß, A.; Otto, T.
Konferenzbeitrag
2017Inkjet printed metal insulator semiconductor (MIS) diodes for organic and flexible electronic application
Mitra, K.Y.; Sternkiker, C.; Martinez-Domingo, C.; Sowade, E.; Ramon, E.; Carrabina, J.; Gomes, H.L.; Baumann, R.R.
Zeitschriftenaufsatz
2017Inkjet-printed dissolved oxygen and pH sensors on flexible plastic substrates
Moya, A.; Zea, M.; Sowade, E.; Villa, R.; Ramon, E.; Baumann, R.R.; Gabriel, G.
Konferenzbeitrag
2017Integration of self-healing agent into MEMS bonding frames
Kurth, F.; Hofmann, C.; Hertel, S.; Braun, P.; Schroeder, T.J.; Wiemer, M.
Konferenzbeitrag
2017Integration of ZnO nanoparticle transistors on freestanding flexible substrates
Vidor, F.F.; Meyers, T.; Hilleringmann, U.
Konferenzbeitrag
2017Integrationstechnik für ZnO-Nanopartikel-Dünnschichttransistoren
Reker, J.; Meyers, T.; Vidor, F.F.; Hilleringmann, U.
Konferenzbeitrag
2017Investigation on inkjet printing for electromagnetic applications
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R.
Konferenzbeitrag
2017Investigation on inkjet printing for electromagnetic compatibility application
Hartwig, M.; Polomoshnov, M.; Zichner, R.; Baumann, R.R.
Konferenzbeitrag
2017Investigation on the temperature distribution of integrated heater configurations in a Lab-on-a-Chip system
Streit, P.; Nestler, J.; Schulze, R.; Shaporin, A.; Otto, T.
Konferenzbeitrag
2017Investigations on Parylene C for its integrability into MEMS
Selbmann, F.; Baum, M.; Hecker, C.; Roscher, F.; Enderlein, T.; Wiemer, M.; Joseph, Y.; Otto, T.
Konferenzbeitrag
2017Large-scale fabrication of LP-CVD Si3N4 photonic crystal structures as freestanding reflectors with 1 mm aperture for Fabry-Pérot interferometers
Helke, C.; Hiller, K.; Werner, T.; Reuter, D.; Meinig, M.; Kurth, S.; Nowak, C.; Kleinjans, H.; Otto, T.
Konferenzbeitrag
2017Life cycle engineering and management - fostering the management-orientation of life cycle engineering activities
Götze, U.; Peças, P.; Schmidt, A.; Symmank, C.; Henriques, E.; Ribeiro, I.; Schüller, M.
Zeitschriftenaufsatz
2017Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation
Schaller, R.; Strutz, V.; Theuss, H.; Dudek, R.; Rzepka, S.
Konferenzbeitrag
2017Light-induced magnetoresistance in solution-processed planar hybrid devices measured under ambient conditions
Banerjee, S.; Bülz, D.; Reuter, D.; Hiller, K.; Zahn, D.R.T.; Salvan, G.
Zeitschriftenaufsatz
2017A low-frequency piezoelectric-electromagnetic-triboelectric hybrid broadband vibration energy harvester
He, X.; Wen, Q.; Sun, Y.; Wen, Z.
Zeitschriftenaufsatz
2017Low-temperature chemical vapor deposition of cobalt oxide thin films from a dicobaltatetrahedrane precursor
Melzer, M.; Nichenametla, Charan K.; Georgi, Colin; Lang, Heinrich; Schulz, S.E.
Zeitschriftenaufsatz
2017Low-voltage DNTT-based thin-film transistors and inverters for flexible electronics
Meyers, T.; Vidor, F.F.; Brassat, K.; Lindner, J.K.N.; Hilleringmann, U.
Zeitschriftenaufsatz
2017Mass production of magnesium silicide as a TEG material
Schoenhoff, M.; Hilleringmann, U.; Boor, J. de
Konferenzbeitrag
2017Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fuegmann, U.; Illing-Günther, H.; Nestler, D.; Huebler, A.C.; Nendel, K.; Kroll, L.; Otto, T.
Konferenzbeitrag
2017Material-integrated composite humidity sensors for condition monitoring of fiber-reinforced plastics
Martin, J.; Shetty, K.; Reimann, N.; Neukirchner, S.; Fügmann, U.; Illing-Günther, H.; Nestler, D.; Hübler, A.C.; Nendel, K.; Kroll, L.; Otto, T.
Zeitschriftenaufsatz
2017Mechanical, electronic and optical properties of strained carbon nanotubes
Wagner, C.F.
Dissertation
2017MEMS-basiertes Schallemissionssensorsystem für die Zustandsüberwachung
Berner, T.; Schulze, R.; Shaporin, A.; Forke, R.; Otto, T.
Konferenzbeitrag
2017Microfluidic setup for on-line SERS monitoring using laser induced nanoparticle spots as SERS active substrate
Buja, Oana-M.; Gordan, Ovidiu D.; Leopold, Nicolae; Morschhauser, A.; Nestler, J.; Zahn, Dietrich R.T.
Zeitschriftenaufsatz
2017Modelling and characterisation of a grease pump-out test stand and its use for accelerated stress testing of thermal greases
Wunderle, B.; Heilmann, J.; May, D.; Arnold, J.; Hirscheider, J.; Bauer, J.; Schacht, R.; Vogel, J.; Ras, M.A.
Konferenzbeitrag
2017Multilayer micromechanics process with thick functional layers (EPyC40)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T.
Zeitschriftenaufsatz
2017Multiparameter and Parallel Optimization of ReaxFF Reactive Force Field for Modeling the Atomic Layer Deposition of Copper
Hu, X.; Schuster, J.; Schulz, S.E.
Zeitschriftenaufsatz
2017Nanophotonic biosensor for space exploration (PBSA instrument)
Pantoja, S.; Parro, V.; Nestler, J.; Geidel, S.; Martins, R.; Cuesta, F.; Elvira, J.G.; Sousa, A.
Konferenzbeitrag
2017Novel concept of integrated micro actuation of membranes in liquid environments
Stiehl, C.; Enderlein, T.; Nestler, J.; Otto, T.
Konferenzbeitrag
2017A novel gyroscopic actuation concept for 2D MEMS micromirrors
Kaupmann, P.; Pinter, S.; Franz, J.; Streiter, R.; Otto, T.
Zeitschriftenaufsatz
2017Organic thin-film transistors for AMOLED applications
Meyers, T.; Vollbrecht, J.; Vidor, F.F.; Reker, J.; Kitzerow, H.-S.; Hilleringmann, U.
Konferenzbeitrag
2017Part II of the Special Issue on 3rd International Conference on Engineering and Technology Innovation (ICETI 2014)
Hsieh, W.H.; Michel, B.
Zeitschriftenaufsatz
2017Polypropylene-based melt mixed composites with singlewalled carbon nanotubes for thermoelectric applications: Switching from p-type to n-type by the addition of polyethylene glycol
Luo, J.; Cerretti, G.; Krause, B.; Zhang, L.; Otto, T.; Jenschke, W.; Ullrich, M.; Tremel, W.; Voit, B.; Poetschke, P.
Zeitschriftenaufsatz
2017Printing technologies for the manufacturing of passive microwave components: Antennas
Godlinski, Dirk; Zichner, Ralf; Zöllmer, Volker; Baumann, Reinhard R.
Zeitschriftenaufsatz
2017Prozess- und Zustandsüberwachung von Leichtbaustrukturen durch Sensorintegration
Rost, F.; Arnold, B.; Decker, R.; Mehner, J.; Kroll, L.; Rzepka, S.; Otto, T.
Konferenzbeitrag
2017Prüfvorrichtung und Verfahren zur Ermittlung einer Abreißfestigkeit
Roscher, Frank; Vogel, Klaus; Wiemer, Maik; Bräuer, Jörg; Schade, Dirk
Patent
2017Real time solid waste monitoring using cloud and sensors technologies
Likotiko, E.; Petrov, D.; Mwangoka, J.; Hilleringmann, U.
Konferenzbeitrag
2017Reliability characterization of aerosol jet printing technology for multilayer secure envelopes
Lecavelier, A.; Tezenas, A.; Brizoux, M.; Roscher, F.; Saeidi, N.
Konferenzbeitrag
2017Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
Heilmann, J.; Nikitin, I.; Zschenderlein, U.; May, D.; Pressel, K.; Wunderle, B.
Zeitschriftenaufsatz
2017Reliability investigation on SiC based diode and MOSFET modules developed for high power conversion in medical X-ray applications
Otto, A.; Dudek, R.; Rzepka, S.; Abo Ras, M.; Essen, T. von; Bast, M.; Hindel, A.; Eisele, R.; Mueter, U.; Lunding, A.
Konferenzbeitrag
2017Results of multi-mass high precision vibratory MEMS gyroscopes for two types of system approaches
Popova, I.; Lestev, A.; Fedorov, M.; Rakityansky, O.; Ivanov, V.; Semenov, A.; Forke, R.; Shaporin, A.; Hiller, K.; Koehler, D.; Konietzka, S.
Konferenzbeitrag
2017Robust design optimization: On methodology and short review
Bektas, E.; Broermann, K.; Pecanac, G.; Rzepka, S.; Silber, C.; Wunderle, B.
Konferenzbeitrag
2017Robust vibration Sensor for condition monitoring in railway applications
Pleul, M.; Streit, P.; Polster, K.; Schulze, R.; Schuh, A.; Meinecke, C.; Reuter, D.
Konferenzbeitrag
2017Scalable fabrication of carbon nanotube field-effect transistors (CNT-FETs) implementing wafer-level electron-beam lithography and dielectrophoretic CNT assembly
Blaudeck, T.; Hermann, S.; Hartmann, M.; Böttger, S.; Tittmann-Otto, J.; Heldt, G.; Reuter, D.; Schulz, S.E.
Konferenzbeitrag
2017Selective immobilization of 6HB and Tablet DNA origami Templates on microstructured surfaces by DLC and CF-polymer contrasting suitable for microfluidic integration
Hann, J.; Helke, C.; Fischer, F.; Lakatos, M.; Heerwig, A.; Nestler, J.; Meritg, M.; Gessner, T.
Zeitschriftenaufsatz
2017Sens-o-Spheres - A concept for location independent acquisition of process measurement signals
Lüke, T.; Büker, M.-J.; Hedayat, C.; Lenk, F.; Lauterbach, T.; Gernandt, T.; Moll, R.; Buchner, P.
Konferenzbeitrag
2017Sensor components of a miniaturized implant for haemodynamic controlling
Weidenmüller, Jens; Dogan, Özgü; Stanitzki, Alexander; Baum, Mario; Wünsch, Dirk; Wiemer, Maik; Görtz, Michael
Zeitschriftenaufsatz
2017Silicon sacrificial layer technology for the production of 3D MEMS (EPyC process)
Louriki, L.; Staffeld, P.; Kaelberer, T.; Otto, T.
Zeitschriftenaufsatz
2017Special Issue on 3rd International Conference on Smart Systems Engineering (SmaSys 2015)
Khosla, A.; Furukawa, H.; Michel, B.
Editorial
2017Temporary wafer bonding - key technology for MEMS devices
Wuensch, D.; Purwin, L.; Büttner, L.; Martinka, R.; Schubert, I.; Junghans, R.; Baum, M.; Wiemer, M.; Otto, T.
Konferenzbeitrag
2017A test device for in situ TEM investigations on failure behaviour of carbon nanotubes embedded in metals under tensile load
Jöhrmann, N.; Hartmann, S.; Jacob, K.; Bonitz, J.; MacArthur, K.E.; Hermann, S.; Schulz, S.E.; Wunderle, B.
Konferenzbeitrag
2017Thermo-mechanical and mechanical robustness of the INCOBAT smart battery management system
Otto, A.; Rzepka, S.; Döring, R.; Scheiter, L.; Armengaud, E.
Konferenzbeitrag
2017Welcome to the 11th Smart Systems Integration
Otto, T.
Konferenzbeitrag