Vogel, D.D.VogelLuczak, F.F.LuczakSchubert, A.A.SchubertMichel, B.B.Michel2022-03-092022-03-091999https://publica.fraunhofer.de/handle/publica/3337532-s2.0-0342297936en621MicroDAC deformation analysis on solder interconnects for flip chipconference paper