Characteristics of fritting contacts utilized for micromachined wafer probe cards

Itoh, T.T.ItohSuga, T.T.SugaEngelmann, G.G.EngelmannWolf, J.J.WolfEhrmann, O.O.EhrmannReichl, H.H.Reichl2022-03-032022-03-032000https://publica.fraunhofer.de/handle/publica/19658110.1063/1.11506102-s2.0-0009776026en621681Characteristics of fritting contacts utilized for micromachined wafer probe cardsjournal article