Wandesleben, Annika FranziskaAnnika FranziskaWandeslebenSchrötke, ElenaElenaSchrötkeKrause, RobertRobertKrauseHaufe, NoraNoraHaufeWislicenus, MarcusMarcusWislicenusLilienthal-Uhlig, BenjaminBenjaminLilienthal-UhligVogt, CarlaCarlaVogt2025-08-212025-08-212025https://publica.fraunhofer.de/handle/publica/49092410.1109/ICICDT65192.2025.110780652-s2.0-105012573913By establishing contamination management concepts for indium and designing specialized cleaning strategies, this study effectively demonstrates the successful integration of metallic indium as material for superconducting integrated circuits in a CMOS line. The research work illustrates the successful deposition of indium bumps, paving the way for standardized applications in future developments, including the bonding of quantum computer chips.enfalseCMOScontamination managementIndium bumpsinterconnectsquantum computingVPD-ICP-MSconference paper