A new approach to chip size package using meniscus soldering and FPC-bonding

Kallmayer, C.C.KallmayerJung, E.E.JungKasulke, P.P.KasulkeAzadeh, R.R.AzadehAzdasht, G.G.AzdashtZakel, E.E.ZakelReichl, H.H.Reichl2022-03-092022-03-091997https://publica.fraunhofer.de/handle/publica/328744en621A new approach to chip size package using meniscus soldering and FPC-bondingconference paper