Schulz, S.E.S.E.SchulzBaumann, J.J.BaumannWeidner, J.-O.J.-O.WeidnerHasse, W.W.HasseKoerner, H.H.KoernerGessner, T.T.Gessner2022-03-092022-03-091998https://publica.fraunhofer.de/handle/publica/331624en621Morphology and electromigration lifetime of copper lines with different barriersconference paper