Process and equipment simulation of copper CVD using Cu(hfac)vtms

Wolf, H.H.WolfGieser, H.H.GieserRiedel, S.S.RiedelStreiter, R.R.StreiterGessner, T.T.Gessner2022-03-032022-03-031999https://publica.fraunhofer.de/handle/publica/19568710.1016/S0167-9317(98)00257-3en621Process and equipment simulation of copper CVD using Cu(hfac)vtmsjournal article