Koch, SebastianSebastianKochOrr, Benjamin J.Benjamin J.OrrGossner, H.H.GossnerGieser, Horst A.Horst A.GieserMaurer, LinusLinusMaurer2022-03-052022-03-052019https://publica.fraunhofer.de/handle/publica/25591410.1109/TEMC.2018.2811645The objective of this work is to identify electrostatic discharge (ESD) related soft failure mechanisms early in the product life cycle. We compare different methods of injecting ESD stress into USB 3.0 interfaces which are regularly exposed to ESD stress during end-user operation. A directional injection method is applied which is compatible to high-speed line operation and capable to provide quantitative information about failure levels. Soft failure modes are investigated depending on the operational state of the system under test. Five typical categories of soft failure modes of a USB 3.0 interface could be identified. A method to use the characterization data gained from system verification boards for final system design is presented.enelectrostatic dischargefailure analysisperipheral interfacesoperational statesoft failure modespowered USB 3.0 interfaceESD stresssoft failure mechanismsquantitative informationsystem under testcharacterization datasystem verification boardssystem designfailure levelshigh-speed line operationdirectional injection methodend-user operationproduct life cycleelectrostatic discharge related soft failure mechanismsUSBUniversal Serial Buselectrostatic dischargestressprobeIEC standardsmagnetomechanical effectsmagnetic susceptibilityelectrostatic dischargefailure analysishigh-speed interconnectintegrated circuit reliability621journal article