Ramm, PeterPeterRammPoupon, GillesGillesPouponCouderc, PascalPascalCoudercLeitgeb, MarkusMarkusLeitgebTaklo, Maaike M.V.Maaike M.V.Taklo2022-03-062022-03-062017https://publica.fraunhofer.de/handle/publica/260392endevice packaging3D integrationwafer-level packagingsensors621537The Advancement of Device Packaging - A Resume on IMAPS DPC 2017journal article