Himpel, G.G.HimpelLenk, R.R.Lenk2022-03-032022-03-031997https://publica.fraunhofer.de/handle/publica/1909682-s2.0-6944253500A polyethylene-based binder system was used to injection moud SiC thread guides and test rods. The specimens, with wall thicknesses of 3 and 6 deg mm, had a solids volume content of 54 deg per cent and 51 deg per cent respectively. In preparing to remove the binder from the injection moulded parts, a thermal analytical examination of the binder system, ist components and the injection moulded bodies was made. In order to determine the shortest time/temperature curve for defect-free debinding, heating/temperature defect diagrams for both were drawn up. Through knowledge of the critical heating rarte/temperature relationship, the necessary debinding curves can set up dependent upon the thicknees of the parts. Defect-free debinding of the ceramic pieces is compared to debinding curves of thr powder metallurgy.endefect-free debindingdefektfreie Binderfreisetzungendkonturgenaue Formgebunginjection mouldingnear-net-shape forming methodSiliciumnitridkeramiksilicon carbide ceramicsSpritzgußthermal binder removalthermische Binderfreisetzung666620journal article