Altana, AntonioAntonioAltanaYakushenko, AlexeyAlexeyYakushenkoIakovlev, AleksandrAleksandrIakovlev2024-09-062024-09-062022-10-12https://publica.fraunhofer.de/handle/publica/474611Method (100), comprising providing (110) an electrically insulating substrate (210) and forming (120) a through-hole (220; 2201-2208) in the substrate (210) between a first (212) and a second (214) main surface region of the substrate (210). Additionally, the method (100) comprises a structured deposition (130) of conductive material on the first main surface region (212) of the substrate (210), so that walls (222) of the through-hole (220; 2201-2208) are covered by the conductive material and so that first conductive traces (230) are formed on the first main surface region (212) of the substrate (210); and a structured deposition (140) of further conductive material on the second main surface region (214) of the substrate (210) so that second conductive traces (240) are formed on the second main surface region (214) of the substrate (210).enpatentEP4072252 A1EP20210167517